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BLF6G10LS-135RN,11

NXP Semiconductors

BLF6G10LS-135RN,11 by NXP Semiconductors

BLF6G10LS-135RN,11 by NXP Semiconductors is a single N-channel MOSFET designed for enhancement mode operation. It supports a max drain current of 32 A and operates at temperatures up to 225 °C, making it ideal for high-power applications in RF amplifiers.

Median Price

$73.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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RFMW

USA . 800 parts In-Stock

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Rochester

USA . 92 parts In-Stock

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$73.630

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$65.880

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$62.010

92

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$65.880

$62.010

Distributors (In-Stock)

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Digiode

USA . 3,099 parts In-Stock

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$77.928

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Vyrian

USA . 8,324 parts In-Stock

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Anansix

USA . 2,042 parts In-Stock

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Native Components

USA . 500 parts In-Stock

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$0.611

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Northwest PG Solutions

USA . 277 parts In-Stock

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$0.672

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277

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Corphita

USA . 4,852 parts In-Stock

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$73.827

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UNI Independent Distributors

Spain . 3,929 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance with the BLF6G10LS-135RN,11 from NXP Semiconductors. Renowned for its exceptional quality and reliability, NXP delivers a power FET that excels in demanding applications. This advanced N-channel transistor ensures efficient energy management, enabling your designs to thrive under high temperatures and current loads. Experience enhanced efficiency and durability, making it an ideal choice for automotive, industrial, and RF solutions. Elevate your projects with NXP’s trusted innovation!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, which results in lower on-resistance and better efficiency, making it a preferred choice for high-performance applications.

Configuration: SINGLE

A single configuration keeps the design simple and compact, making integration into various applications straightforward and cost-effective.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the transistor to be off when no voltage is applied, providing better control over power consumption and performance in digital circuits.

Maximum Drain Current (Abs) (ID): 32 A

With a maximum drain current of 32 A, this FET can handle significant loads, making it suitable for high-power applications and reducing the need for multiple devices in parallel.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and reduces power consumption, enhancing the efficiency of the circuit in which this FET is used.

Maximum Operating Temperature: 225 °C

A maximum operating temperature of 225 °C enables this FET to perform reliably in challenging environments, making it ideal for industrial and automotive applications.

Maximum Drain Current (ID): 32 A

The ability to sustain 32 A helps streamline designs by providing a robust solution for high-demand applications without thermal concerns.

Technical Specifications

Power Field Effect Transistors (FET) BLF6G10LS-135RN,11 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF6G10LS-135RN,11 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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