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BLF647PS,112

NXP Semiconductors

BLF647PS,112 by NXP Semiconductors

NXP Semiconductors BLF647PS,112 is an N-CHANNEL FET with ENHANCEMENT MODE operation. It features METAL-OXIDE SEMICONDUCTOR technology, 200°C max operating temp, and 30s at 260°C peak reflow time. Ideal for power applications requiring high-performance transistors.

Median Price

$213.195

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Mouser Electronics

USA . 43 parts In-Stock

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$203.930

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DigiKey

USA . 119 parts In-Stock

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$222.460

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$178.854

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Digiode

USA . 1,340 parts In-Stock

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$150.765

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Nova Conductors

Japan . 19 parts In-Stock

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$199.375

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Vyrian

USA . 7,352 parts In-Stock

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VNN

France . 1,902 parts In-Stock

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Anansix

USA . 1,253 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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Aztec Data Supply Inc.

USA . 319 parts In-Stock

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$1.930

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AZTECH Wire

Italy . 321 parts In-Stock

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$12.308

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Ampacity Inc.

Singapore . 121 parts In-Stock

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$134.890

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Corphita

USA . 1,611 parts In-Stock

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$142.830

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Continental Prestige Electronics

USA . 294 parts In-Stock

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$199.375

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Microchip USA

USA . 9,782 parts In-Stock

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$326.250

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UNI Independent Distributors

Spain . 2,894 parts In-Stock

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Perfect Parts

USA . 1,668 parts In-Stock

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Argo Parts USA

USA . 823 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$195.388

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$189.406

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$185.419

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GreenTree Electronics

Israel . 140 parts In-Stock

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Overview

Unlock the power of high-performance electronics with the BLF647PS,112 by NXP Semiconductors. Designed to meet the demands of modern technology, this N-CHANNEL Power Field Effect Transistor offers enhanced efficiency and reliability for a wide range of applications. From automotive to industrial, this semiconductor marvel delivers unmatched quality and performance. Experience the difference with NXP Semiconductors and take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher switching speeds compared to P-CHANNEL FETs, making them suitable for high efficiency applications.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs offer easier control of the on/off switching behavior, providing more precise and efficient power management in various electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high power efficiency, low power consumption, and fast switching speeds, making it an ideal choice for power applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in harsh operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the FET is not exposed to excessive heat for a prolonged period, reducing the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can endure the soldering process without sustaining damage, ensuring robust assembly and reliability in manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) BLF647PS,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLF647PS,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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