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BLF6G13L-250P,112

NXP Semiconductors

BLF6G13L-250P,112 by NXP Semiconductors

NXP Semiconductors BLF6G13L-250P,112 is an N-CHANNEL FET with 42A max drain current and 200°C operating temp. Ideal for power applications requiring high current handling and efficient performance in enhancement mode operation.

Median Price

$209.838

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28 parts In-Stock

1+ parts

$178.590

100+ parts

$167.870

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$157.160

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28

$178.590

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$157.160

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RFMW

USA . 109 parts In-Stock

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$213.280

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DigiKey

USA . 240 parts In-Stock

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Flip Electronics (Authorized)

USA . 81 parts In-Stock

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Verical

USA . 28 parts In-Stock

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$209.838

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$196.450

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28

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$196.450

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Distributors (In-Stock)

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Digiode

USA . 4,568 parts In-Stock

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$196.992

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Vyrian

USA . 4,474 parts In-Stock

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Anansix

USA . 1,778 parts In-Stock

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Flip Electronics

USA . 240 parts In-Stock

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240

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Distributors (Availability)

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Native Components

USA . 807 parts In-Stock

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$12.650

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807

$12.650

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Northwest PG Solutions

USA . 1,392 parts In-Stock

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$13.915

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$12.523

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$13.915

$12.523

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Ampacity Inc.

Singapore . 53 parts In-Stock

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$176.260

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Corphita

USA . 1,358 parts In-Stock

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$186.624

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1,358

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Component Stockers USA

USA . 3 parts In-Stock

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$215.070

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$215.070

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Continental Prestige Electronics

USA . 3 parts In-Stock

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$248.850

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UNI Independent Distributors

Spain . 2,865 parts In-Stock

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Overview

Unlock the power of innovation with NXP Semiconductors' BLF6G13L-250P,112 Power FET. Designed for high-performance applications, this N-CHANNEL transistor offers unparalleled reliability and efficiency. From telecommunications to industrial automation, this enhancement mode transistor delivers exceptional performance under demanding conditions. Trust NXP Semiconductors to provide you with cutting-edge technology that exceeds expectations. Experience the difference today.

Feature Benefit Bullets

Polarity/Channel Type

N-CHANNEL FETs are commonly used in high power applications due to their low ON-state resistance and high current-carrying capabilities.

Operating Mode

ENHANCEMENT MODE FETs are easier to control and have lower ON-state resistance compared to DEPLETION MODE FETs, making them more efficient for power applications.

Maximum Drain Current (ID)

A high maximum drain current of 42A allows this FET to handle large current loads, making it suitable for high-power applications.

Field Effect Transistor Technology

MOSFET technology offers high switching speeds, low ON-state resistance, and high input impedance, making it ideal for power electronics applications.

Maximum Operating Temperature

A high maximum operating temperature of 200°C ensures reliable performance in high-temperature environments, making this FET suitable for industrial applications.

Maximum Time At Peak Reflow Temperature (s)

The ability to withstand peak reflow temperatures for up to 30 seconds ensures proper soldering during manufacturing processes, increasing the reliability of the FET.

Peak Reflow Temperature °C

With a peak reflow temperature of 260°C, this FET can withstand high-temperature soldering processes without damage, ensuring ease of assembly in manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) BLF6G13L-250P,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLF6G13L-250P,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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