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BLF6G13LS-250P,112

NXP Semiconductors

BLF6G13LS-250P,112 by NXP Semiconductors

BLF6G13LS-250P,112 by NXP Semiconductors is a N-CHANNEL FET with 42A ID, ideal for power applications. Operating in enhancement mode with MOSFET technology, it can withstand up to 200°C. With a peak reflow temperature of 260°C and 30s max time at peak reflow temp, it ensures reliable performance in high-power circuits.

Median Price

$209.838

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

$178.590

100+ parts

$167.870

1k+ parts

$157.160

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50

$178.590

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$157.160

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RFMW

USA . 99 parts In-Stock

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$213.280

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99

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Flip Electronics (Authorized)

USA . 428 parts In-Stock

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428

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DigiKey

USA . 278 parts In-Stock

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278

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Verical

USA . 40 parts In-Stock

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$209.838

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$196.450

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40

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$196.450

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Distributors (In-Stock)

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Digiode

USA . 4,088 parts In-Stock

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$196.992

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4,088

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Vyrian

USA . 3,721 parts In-Stock

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$207.360

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Anansix

USA . 1,003 parts In-Stock

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Flip Electronics

USA . 278 parts In-Stock

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278

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.730

100+ parts

$0.664

1k+ parts

$0.599

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$0.730

$0.664

$0.599

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Corphita

USA . 1,089 parts In-Stock

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$186.624

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1,089

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Continental Prestige Electronics

USA . 50 parts In-Stock

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$248.850

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UNI Independent Distributors

Spain . 2,289 parts In-Stock

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Northwest PG Solutions

USA . 1,644 parts In-Stock

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$4.443

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1,644

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Native Components

USA . 591 parts In-Stock

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$4.398

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$4.398

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Overview

Power up your projects with the BLF6G13LS-250P,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality Power Field Effect Transistors (FET) that are perfect for a wide range of applications. From enhancing efficiency in power supplies to optimizing performance in RF amplifiers, this N-CHANNEL FET operates in Enhancement Mode and boasts a maximum Drain Current of 42 A. Trust in NXP Semiconductors for reliable technology that exceeds expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high-power applications due to their ability to handle large amounts of current.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer high input impedance, making them suitable for various switching applications.

Maximum Drain Current (ID): 42 A

With a high maximum drain current of 42A, this FET is capable of handling heavy loads, making it ideal for power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low input capacitance, high speed, and low noise performance, making them efficient for switching operations.

Maximum Operating Temperature: 200 °C

The FET can operate at temperatures up to 200°C, allowing it to be used in high-temperature environments without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand a peak reflow temperature for up to 30 seconds, ensuring reliable performance during soldering and assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can be easily integrated into PCB assembly processes without risk of damage.

Technical Specifications

Power Field Effect Transistors (FET) BLF6G13LS-250P,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLF6G13LS-250P,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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