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BFU710F

NXP Semiconductors

BFU710F by NXP Semiconductors

BFU710F by NXP Semiconductors is an NPN RF small signal BJT designed for switching applications. It features a max collector-emitter voltage of 2.8V, operates up to 43GHz, and comes in a compact rectangular surface mount package. Ideal for KA band circuits, it ensures efficient performance in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,829 parts In-Stock

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2,829

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Digiode

USA . 782 parts In-Stock

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Anansix

USA . 435 parts In-Stock

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435

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One Stop Electronics

USA . 1,265 parts In-Stock

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$51.050

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Kepictronics

USA . 306,000 parts In-Stock

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306,000

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UNI Independent Distributors

Spain . 7,605 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Northwest PG Solutions

USA . 1,289 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Native Components

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Corphita

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Overview

Unlock exceptional performance with the BFU710F from NXP Semiconductors, a pinnacle of quality in RF small signal transistors. Designed for seamless switching applications, this compact and efficient NPN transistor ensures reliability in demanding environments. With NXP’s industry-leading expertise, you benefit from superior reliability and longevity, making it ideal for innovative designs in telecommunications and consumer electronics. Elevate your projects with unmatched precision and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: NPN

As an NPN transistor, this device is ideal for switching applications, allowing it to interface easily with other components.

Configuration: SINGLE

The single configuration simplifies design and integration, offering versatility for various circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient operation, essential for modern electronics.

Surface Mount: YES

Surface mount capability enables compact designs, improving space efficiency on PCBs and facilitating automated assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on circuit boards, aiding in the effective use of space and improving thermal performance.

Terminal Form: FLAT

Flat terminals promote better contact and electrical performance, reducing parasitic effects and enhancing reliability.

Highest Frequency Band: KA BAND

Operational capability in the Ka band ensures high-speed performance, making it suitable for advanced communication applications.

No. of Terminals: 4

Four terminals allow for versatile connection options, facilitating ease of integration into a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes board space, allowing for more compact designs and improved layout flexibility.

Maximum Collector-Emitter Voltage: 2.8 V

A maximum voltage rating of 2.8 V allows for low-voltage operation, making it suitable for battery-powered and energy-efficient applications.

Transistor Element Material: SILICON GERMANIUM

Utilizing silicon-germanium material provides enhanced performance characteristics, particularly in high-frequency applications.

Maximum Collector Current (IC): 0.01 A

The maximum collector current of 10 mA is optimal for low-power applications, ensuring energy efficiency in circuits.

Terminal Finish: TIN

Tin terminal finishes promote good solderability, improving assembly reliability and maintaining long-term connection integrity.

Terminal Position: DUAL

Dual terminal positioning affords flexibility in circuit design and allows for better electrical routing options.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes and provides robust thermal management during assembly.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C provides compatibility with high-temperature processes, ensuring reliability in manufacturing.

Nominal Transition Frequency (fT): 43000 MHz

With a nominal transition frequency of 43 GHz, this transistor excels in high-speed applications, making it ideal for RF and microwave communications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFU710F attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

2.8 V

Configuration:

Highest Frequency Band:

KA BAND

JESD-30 Code:

R-PDSO-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON GERMANIUM

Nominal Transition Frequency (fT):

Trade Compliance

BFU710F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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