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BF861B-TAPE-7

NXP Semiconductors

BF861B-TAPE-7 by NXP Semiconductors

BF861B-TAPE-7 by NXP Semiconductors is a single N-channel FET designed for amplifier applications. It features a 25V min DS breakdown voltage, operates in depletion mode, and supports surface mount with a max temp of 150 °C. Ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,241 parts In-Stock

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Vyrian

USA . 2,512 parts In-Stock

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Anansix

USA . 555 parts In-Stock

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555

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Native Components

USA . 182 parts In-Stock

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$1.447

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Northwest PG Solutions

USA . 1,968 parts In-Stock

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$1.592

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One Stop Electronics

USA . 1,156 parts In-Stock

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$47.050

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Corphita

USA . 3,549 parts In-Stock

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UNI Independent Distributors

Spain . 1,410 parts In-Stock

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Overview

Unlock unparalleled performance with the BF861B-TAPE-7 from NXP Semiconductors, a trusted name in innovation. This N-channel small signal FET excels in amplifier applications, delivering exceptional quality and reliability in compact designs. Its robust plastic/epoxy construction ensures durability while featuring superior temperature resilience. Experience enhanced efficiency and versatility that empowers your projects, making it an indispensable choice for engineers and designers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the transistor suitable for various applications in challenging conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, leading to better performance in amplification applications, making this product ideal for amplifiers.

Configuration: SINGLE

A single configuration allows for simpler circuit design and integration, which can lead to reduced costs and improved reliability.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor provides efficient signal amplification, making it a valuable component in audio and RF systems.

Surface Mount: YES

Surface mount capability allows for compact design and automated assembly processes, ensuring faster production and lower manufacturing costs.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25V ensures robustness and reliability in voltage-sensitive applications, providing safety and efficacy in circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes PCB layout efficiency, allowing for more compact designs and better space utilization.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and ease of manual soldering, contributing to overall assembly quality.

Operating Mode: DEPLETION MODE

Operating in depletion mode allows for better control of device operation and characteristics in certain applications, providing flexibility in design.

No. of Terminals: 3

With three terminals, this transistor can efficiently handle the necessary connections for common circuit configurations, facilitating easier integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for space-constrained applications, allowing for greater design flexibility in compact electronics.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides low noise and stable operation, making this device suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this device can operate in high-temperature environments, enhancing durability and performance.

Transistor Element Material: SILICON

Silicon as the element material offers excellent electronic properties, making it a reliable choice for various electronic applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and placement, aiding in efficient signal routing and layout.

Maximum Feedback Capacitance (Crss): 2.7 pF

Low feedback capacitance minimizes distortion and improves frequency response, making this FET a great choice for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BF861B-TAPE-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.7 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF861B-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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