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BF861A-TAPE-13

NXP Semiconductors

BF861A-TAPE-13 by NXP Semiconductors

BF861A-TAPE-13 by NXP Semiconductors is a single N-channel FET designed for amplifier applications. It features a 25V min DS breakdown voltage, operates in depletion mode, and supports surface mount with a max temp of 150 °C. Ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,646 parts In-Stock

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Vyrian

USA . 2,766 parts In-Stock

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Anansix

USA . 1,420 parts In-Stock

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Native Components

USA . 866 parts In-Stock

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$0.730

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866

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Northwest PG Solutions

USA . 2,312 parts In-Stock

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$0.802

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2,312

$0.802

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One Stop Electronics

USA . 1,481 parts In-Stock

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$16.050

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1,481

$16.050

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UNI Independent Distributors

Spain . 3,054 parts In-Stock

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Corphita

USA . 380 parts In-Stock

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380

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Overview

Unlock the power of precision with the BF861A-TAPE-13 from NXP Semiconductors, a trusted leader in innovative technology. Designed for superior performance in small signal applications, this N-channel FET excels in amplification tasks, ensuring crystal-clear outputs. Its robust plastic/epoxy construction and compact surface-mount design make it ideal for space-constrained projects. Elevate your designs with unmatched reliability and efficiency that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often preferred for amplifying and switching applications, as they generally provide better performance and efficiency.

Configuration: SINGLE

A single configuration simplifies integration into circuits and helps in maintaining compact designs.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET will provide high gain and performance in audio or signal processing applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and improved manufacturing processes, making this FET ideal for modern electronic devices.

Minimum DS Breakdown Voltage: 25 V

The 25 V breakdown voltage ensures this FET can operate safely in applications with moderate to high voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, facilitating easy assembly and layout flexibility.

Terminal Form: GULL WING

Gull wing terminals enhance the soldering process and provide mechanical stability, ideal for high-volume manufacturing.

Operating Mode: DEPLETION MODE

Depletion mode FETs are useful for linear amplification and can operate effectively in a lower voltage range, offering versatility in applications.

No. of Terminals: 3

With only three terminals, this FET is easy to integrate into designs, reducing complexity and minimizing potential for error in connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes PCB space usage, making it suitable for compact electronic devices.

Field Effect Transistor Technology: JUNCTION

Junction technology improves performance in terms of switching speed and power efficiency, making this FET reliable in fast applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows this FET to be used in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, providing excellent electrical properties, reliability, and cost-effectiveness.

Terminal Position: DUAL

Dual terminal positioning allows for simplified PCB layout and enhances thermal performance by better heat distribution.

Maximum Feedback Capacitance (Crss): 2.7 pF

A low feedback capacitance of 2.7 pF improves high-frequency response, making this FET suitable for RF and fast-switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BF861A-TAPE-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.7 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF861A-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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