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BF861A,215

NXP Semiconductors

BF861A,215 by NXP Semiconductors

BF861A,215 by NXP Semiconductors is a small signal N-CHANNEL FET with 25V DS breakdown voltage. Ideal for amplifier applications, it operates in depletion mode and has a max power dissipation of 0.25W. With a peak reflow temperature of 260°C, this transistor features a junction technology and offers low feedback capacitance at 2.7pF.

Median Price

$0.253

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$0.253

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VNN

France . 5,609 parts In-Stock

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5,609

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Digiode

USA . 4,218 parts In-Stock

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Anansix

USA . 2,544 parts In-Stock

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Vyrian

USA . 2,394 parts In-Stock

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Electronic Treasures

USA . 2,170 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

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$0.248

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$0.238

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100

$0.248

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$0.238

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Continental Prestige Electronics

USA . 5,794 parts In-Stock

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$0.253

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$0.248

5,794

$0.253

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$0.248

Argo Parts USA

USA . 1,077 parts In-Stock

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$0.253

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$0.245

1,077

$0.253

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$0.245

Ampacity Inc.

Singapore . 820 parts In-Stock

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$3.050

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820

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AZTECH Wire

Italy . 659 parts In-Stock

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$17.603

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One Stop Electronics

USA . 544 parts In-Stock

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$31.050

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544

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Perfect Parts

USA . 14,340 parts In-Stock

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UNI Independent Distributors

Spain . 5,507 parts In-Stock

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Corphita

USA . 4,911 parts In-Stock

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Microchip USA

USA . 363 parts In-Stock

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Overview

Unlock the power of superior performance with the BF861A,215 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability in every product. Ideal for amplifier applications, this N-Channel Small Signal Field Effect Transistor offers exceptional value and benefits to customers seeking high-performance solutions. Experience seamless operation and maximum efficiency with the BF861A,215, setting new standards in the world of electronic components.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the transistor.

Polarity or Channel Type:

N-CHANNEL - N-channel transistors offer high current handling capabilities.

Configuration:

SINGLE - Single configuration simplifies circuit design.

Transistor Application:

AMPLIFIER - Designed specifically for amplification purposes.

Surface Mount:

YES - Allows for easy and secure installation on circuit boards.

Minimum DS Breakdown Voltage:

25 V - Ensures reliable performance in various voltage conditions.

Package Shape:

RECTANGULAR - Rectangular shape facilitates easy placement on a PCB.

Terminal Form:

GULL WING - Gull wing terminals provide additional stability during installation.

Operating Mode:

DEPLETION MODE - Depletion mode transistors are ideal for low-power applications.

No. of Terminals:

3 - 3 terminals simplify connection in circuit design.

Maximum Power Dissipation (Abs):

0.25 W - Able to handle moderate power levels efficiently.

Package Style (Meter):

SMALL OUTLINE - Small outline package conserves space on the PCB.

Field Effect Transistor Technology:

JUNCTION - Junction FET technology offers consistent performance.

Maximum Operating Temperature:

150 °C - Suitable for a wide range of operating environments.

Transistor Element Material:

SILICON - Silicon transistors offer high performance and reliability.

Terminal Finish:

TIN - Tin finish enhances conductivity and prevents corrosion.

Terminal Position:

DUAL - Dual terminal position allows for versatile installation.

Maximum Time At Peak Reflow Temperature (s):

30 - Withstands peak reflow temperatures for soldering.

Peak Reflow Temperature °C:

260 - Can withstand high reflow temperatures during manufacturing.

Maximum Feedback Capacitance (Crss):

2.7 pF - Low feedback capacitance improves high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BF861A,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.7 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF861A,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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