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BF861B-TAPE-13

NXP Semiconductors

BF861B-TAPE-13 by NXP Semiconductors

BF861B-TAPE-13 by NXP Semiconductors is a single N-channel FET designed for amplifier applications. It features a 25V min DS breakdown voltage, operates in depletion mode, and supports surface mount with a max temp of 150 °C. Ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,159 parts In-Stock

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4,159

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Anansix

USA . 1,824 parts In-Stock

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Vyrian

USA . 341 parts In-Stock

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341

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Native Components

USA . 265 parts In-Stock

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$1.630

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265

$1.630

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Northwest PG Solutions

USA . 1,878 parts In-Stock

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$1.793

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$1.793

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One Stop Electronics

USA . 834 parts In-Stock

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$56.050

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834

$56.050

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UNI Independent Distributors

Spain . 7,842 parts In-Stock

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Corphita

USA . 4,729 parts In-Stock

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Overview

Unlock the potential of your designs with the BF861B-TAPE-13 from NXP Semiconductors! Renowned for their cutting-edge technology and commitment to quality, NXP delivers this high-performance N-channel small signal FET, perfect for amplifying signals in compact applications. With its robust construction and exceptional reliability, you gain improved efficiency and thermal performance, ensuring your projects stand out in any market. Elevate your electronics with NXP’s trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material ensures good durability and resistance to environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, resulting in better efficiency and performance for amplifier applications.

Configuration: SINGLE

A single configuration simplifies design and integration, making this FET ideal for compact electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET offers high gain and low distortion, ideal for audio and RF applications.

Surface Mount: YES

Surface mount technology allows for automated assembly and minimizes board space, making it easier to design compact circuits.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25 V provides a reliable safeguard for circuits subjected to transient voltage spikes, enhancing durability.

Package Shape: RECTANGULAR

The rectangular package shape maximizes board space efficiency and is commonly used in many electronic applications, making it easy to integrate.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and support reliable connections on printed circuit boards, ensuring long-term performance.

Operating Mode: DEPLETION MODE

Depletion mode operation allows this FET to be used in normally-on applications, reducing power consumption in certain designs.

No. of Terminals: 3

With only three terminals, this FET has a simple configuration that makes it easy to use in various applications while minimizing footprint.

Package Style (Meter): SMALL OUTLINE

The small outline packaging keeps the footprint minimal, making it ideal for space-constrained applications without compromising performance.

Field Effect Transistor Technology: JUNCTION

Junction technology in FETs typically results in lower noise performance, making this transistor an excellent choice for sensitive amplifier applications.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C ensures reliability in high-temperature environments, suitable for automotive or industrial applications.

Transistor Element Material: SILICON

Silicon as the element material offers good thermal and electrical performance, making this FET reliable for high-performance applications.

Terminal Position: DUAL

Dual terminal positioning supports flexible layout options on the PCB, aiding in efficient circuit design.

Maximum Feedback Capacitance (Crss): 2.7 pF

Low feedback capacitance contributes to faster switching speeds and higher frequency performance, making this FET suitable for RF applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BF861B-TAPE-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.7 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF861B-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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