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BF861B,215

NXP Semiconductors

BF861B,215 by NXP Semiconductors

NXP Semiconductors BF861B,215 is a N-CHANNEL FET with 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications, it features DEPLETION MODE operation and 2.7pF Crss feedback capacitance. This SMALL OUTLINE transistor has a max power dissipation of 0.25W and operates up to 150°C temperature.

Median Price

$0.282

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 45 parts In-Stock

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$0.282

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45

$0.282

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Vyrian

USA . 12,278 parts In-Stock

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12,278

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VNN

France . 4,679 parts In-Stock

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4,679

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Anansix

USA . 2,747 parts In-Stock

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2,747

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Digiode

USA . 487 parts In-Stock

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487

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Bas Electronics GmbH & Co. KG

Germany . 230 parts In-Stock

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Contempo Components LLC

USA . 86 parts In-Stock

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86

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Distributors (Availability)

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Corohmni

South Africa . 138 parts In-Stock

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$0.282

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138

$0.282

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$0.282

100+ parts

$0.268

1k+ parts

$0.255

10k+ parts

$0.251

50

$0.282

$0.268

$0.255

$0.251

Continental Prestige Electronics

USA . 6,310 parts In-Stock

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$0.282

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$0.276

6,310

$0.282

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$0.276

Argo Parts USA

USA . 3,841 parts In-Stock

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$0.282

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$0.274

3,841

$0.282

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$0.274

Aztec Data Supply Inc.

USA . 524 parts In-Stock

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$0.560

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524

$0.560

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.031

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$0.938

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$0.845

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3,000

$1.031

$0.938

$0.845

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AZTECH Wire

Italy . 318 parts In-Stock

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$12.999

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318

$12.999

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Ampacity Inc.

Singapore . 1,317 parts In-Stock

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$19.050

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$19.050

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One Stop Electronics

USA . 1,186 parts In-Stock

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$25.050

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$25.050

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Semicontronic

India . 654 parts In-Stock

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$47.050

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$45.874

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$45.638

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654

$47.050

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$45.638

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S.R.D Solutions

India . 124,000 parts In-Stock

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Perfect Parts

USA . 21,241 parts In-Stock

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Microchip USA

USA . 2,548 parts In-Stock

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UNI Independent Distributors

Spain . 2,235 parts In-Stock

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Corphita

USA . 1,071 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the BF861B,215 by NXP Semiconductors. As a leading manufacturer in the industry, NXP's small signal field effect transistors are designed to amplify signals with precision and efficiency. Ideal for amplifier applications, this N-Channel transistor offers exceptional value and benefits to customers looking for quality components. With its advanced technology and superior design, the BF861B,215 ensures optimal performance and durability, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FET lightweight and durable, ideal for portable applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type enhances the efficiency and performance of the FET, making it suitable for various amplifier applications.

Configuration: SINGLE

The single configuration simplifies the design and integration process, making this FET easy to use for both hobbyists and professionals.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET delivers high-quality amplification with low distortion and noise.

Surface Mount: YES

The surface mount capability allows for easy placement and soldering, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle higher voltages, providing reliability and stability in operation.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space utilization, making this FET suitable for compact designs and tight spaces.

Terminal Form: GULL WING

The gull wing terminal form ensures a secure connection and easy soldering, improving overall reliability in circuit connections.

Operating Mode: DEPLETION MODE

Operating in depletion mode allows for precise current control and low power consumption, making this FET energy-efficient.

No. of Terminals: 3

With 3 terminals, this FET offers flexibility in circuit configurations and connections, enabling a wide range of applications.

Maximum Power Dissipation (Abs): 0.25 W

The maximum power dissipation of 0.25W ensures reliable operation under varying load conditions, enhancing overall performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this FET ideal for compact electronic designs.

Field Effect Transistor Technology: JUNCTION

Utilizing junction technology, this FET offers high switching speeds and low on-resistance for improved performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, ensuring reliable operation.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides high conductivity and temperature stability, enhancing the FET's performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and excellent solderability, ensuring a reliable connection in various environments.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, making this FET suitable for a wide range of circuit configurations.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can withstand high-temperature assembly processes, ensuring proper soldering and reliability.

Maximum Feedback Capacitance (Crss): 2.7 pF

The low maximum feedback capacitance of 2.7pF reduces signal distortion and improves high-frequency performance, making this FET ideal for RF applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BF861B,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.7 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF861B,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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