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BB809

NXP Semiconductors

BB809 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

$10.950

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 4,406 parts In-Stock

1+ parts

$10.950

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4,406

$10.950

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LWI Electronics Inc

India . 12,345 parts In-Stock

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12,345

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Anansix

USA . 1,945 parts In-Stock

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1,945

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Digiode

USA . 724 parts In-Stock

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724

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Chip Stock

USA . 530 parts In-Stock

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530

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Fibra_Brandt Electronic GMBH

Germany . 400 parts In-Stock

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400

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Vyrian

USA . 160 parts In-Stock

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160

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ECAB

Sweden . 100 parts In-Stock

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100

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ACDS - Activité Composants Distribution Service

France . 65 parts In-Stock

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Huijzer Components

Netherlands . 40 parts In-Stock

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40

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LittleDiode

UK . 2 parts In-Stock

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EMSNET

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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One Stop Electronics

USA . 343 parts In-Stock

1+ parts

$1.010

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343

$1.010

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Metaverse IC Inc.

Canada . 66,818 parts In-Stock

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UNI Independent Distributors

Spain . 6,364 parts In-Stock

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Corphita

USA . 3,413 parts In-Stock

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Native Components

USA . 677 parts In-Stock

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677

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Northwest PG Solutions

USA . 566 parts In-Stock

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566

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Ashlea Components Ltd (Excess)

UK . 72 parts In-Stock

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72

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Glotronic Ltd.

UK . 36 parts In-Stock

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36

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Assy Fe

Spain . 2 parts In-Stock

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Technical Specifications

Varactor Diodes BB809 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

CAPACITANCE MATCHED TO 3% FOR ANY TWO DIODES

Minimum Breakdown Voltage:

30 V

Case Connection:

ISOLATED

Config:

SINGLE

Minimum Diode Capacitance Ratio:

8

Nominal Diode Capacitance:

39 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JEDEC-95 Code:

DO-34

JESD-30 Code:

O-LALF-W2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Maximum Reverse Current:

.01 uA

Reverse Test Voltage:

28 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

BB809 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-01-172-2337, 5961011722337, 5961-12-196-0797, 5961121960797

NIIN

011722337, 121960797

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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