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BB804

NXP Semiconductors

BB804 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1,115 parts In-Stock

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$1.710

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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ComSIT Distribution GmbH

Germany . 5,425 parts In-Stock

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Bristol Electronics

USA . 4,210 parts In-Stock

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4,210

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LIBRA Elektronik GmbH

Germany . 3,312 parts In-Stock

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Cogito LLC

Ukraine . 2,394 parts In-Stock

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Pegasus Components GmbH

Germany . 2,000 parts In-Stock

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PC Components Company LLC

USA . 1,459 parts In-Stock

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1,459

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Digiode

USA . 477 parts In-Stock

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477

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Ack Elektronik San.Tic.Ltd.Sti

. 460 parts In-Stock

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460

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Vyrian

USA . 353 parts In-Stock

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353

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Anansix

USA . 283 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 100 parts In-Stock

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J2 Sourcing AB

Sweden . 88 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 34,798 parts In-Stock

1+ parts

$0.101

100+ parts

$0.097

1k+ parts

$0.093

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34,798

$0.101

$0.097

$0.093

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Native Components

USA . 761 parts In-Stock

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$0.125

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$0.120

761

$0.125

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$0.120

Northwest PG Solutions

USA . 564 parts In-Stock

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$0.138

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$0.121

564

$0.138

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$0.121

One Stop Electronics

USA . 1,507 parts In-Stock

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$3.010

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1,507

$3.010

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Kepictronics

USA . 25,984 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Assy Fe

Spain . 9,645 parts In-Stock

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9,645

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UNI Independent Distributors

Spain . 3,905 parts In-Stock

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3,905

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Corphita

USA . 997 parts In-Stock

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997

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Perfect Parts

USA . 241 parts In-Stock

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241

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Technical Specifications

Varactor Diodes BB804 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Minimum Breakdown Voltage:

18 V

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Cap Tolerance:

5.08 %

Minimum Diode Capacitance Ratio:

1.65

Nominal Diode Capacitance:

44.25 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

100 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

18 V

Maximum Reverse Current:

.02 uA

Reverse Test Voltage:

16 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BB804 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-21-910-2588, 5961219102588

NIIN

219102588

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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