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BB804TRL13

NXP Semiconductors

BB804TRL13 by NXP Semiconductors

BB804TRL13 by NXP Semiconductors is a variable capacitance diode featuring a 1.65 min capacitance ratio and dual gull-wing terminals in a compact SO package. It’s ideal for RF tuning applications, ensuring efficient signal modulation. This silicon-based component supports surface mount technology for versatile integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,162 parts In-Stock

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Digiode

USA . 552 parts In-Stock

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552

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Anansix

USA . 294 parts In-Stock

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294

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Distributors (Availability)

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One Stop Electronics

USA . 1,205 parts In-Stock

1+ parts

$2.010

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1,205

$2.010

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Native Components

USA . 226 parts In-Stock

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$365.073

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$357.772

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$354.121

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$350.470

226

$365.073

$357.772

$354.121

$350.470

Northwest PG Solutions

USA . 1,465 parts In-Stock

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$401.581

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1,465

$401.581

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UNI Independent Distributors

Spain . 4,955 parts In-Stock

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4,955

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Corphita

USA . 1,378 parts In-Stock

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Overview

Unlock the potential of your designs with the BB804TRL13 varactor diode from NXP Semiconductors, a trusted leader in innovation. Engineered for superior performance, this compact component offers high-quality variable capacitance ideal for RF applications, tuning circuits, and more. Its reliable construction ensures longevity and efficiency, empowering engineers to create cutting-edge solutions with ease. Elevate your projects with NXP's excellence and reap the rewards of advanced technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protects the diode from environmental factors, enhancing the longevity of the product.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration allows for simpler circuit designs and efficient use in parallel applications, making the diode versatile.

Surface Mount: YES

Surface mount capability saves board space and enables automated assembly processes, increasing manufacturing efficiency.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space utilization on PCBs, allowing for compact circuit designs.

No. of Terminals: 3

The presence of three terminals facilitates flexible circuit configurations, enhancing integration in a variety of circuit applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures minimal footprint on the PCB while maintaining performance, ideal for space-constrained designs.

Terminal Position: DUAL

Dual terminal position allows for easy access and connection, simplifying the assembly process and improving layout flexibility.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, this product excels in tuning applications such as RF circuits and voltage-controlled oscillators, making it a critical component in communication devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, reducing the risk of failure in assembly.

No. of Elements: 2

Having two elements allows for improved performance by sharing load currents, resulting in better efficiency and reliability.

Diode Element Material: SILICON

The use of silicon as the diode element material ensures high efficiency and excellent performance in a variety of applications, particularly in high-frequency scenarios.

Minimum Diode Capacitance Ratio: 1.65

A minimum capacitance ratio of 1.65 indicates a strong performance in capacitance variation, making it suitable for precise tuning applications in RF circuits.

Technical Specifications

Varactor Diodes BB804TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

1.65

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BB804TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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