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BB804TRL

NXP Semiconductors

BB804TRL by NXP Semiconductors

BB804TRL by NXP Semiconductors is a surface-mount varactor diode featuring a dual terminal configuration and a min capacitance ratio of 1.65. Its compact rectangular package makes it ideal for RF tuning applications. This silicon-based component enhances circuit performance in communication devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,047 parts In-Stock

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4,047

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Anansix

USA . 2,620 parts In-Stock

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2,620

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Vyrian

USA . 102 parts In-Stock

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102

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Distributors (Availability)

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One Stop Electronics

USA . 1,388 parts In-Stock

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$0.010

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1,388

$0.010

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Native Components

USA . 651 parts In-Stock

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$89.000

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$85.440

651

$89.000

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$85.440

Northwest PG Solutions

USA . 1,077 parts In-Stock

1+ parts

$97.900

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1,077

$97.900

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UNI Independent Distributors

Spain . 5,857 parts In-Stock

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5,857

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Corphita

USA . 418 parts In-Stock

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418

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Overview

Unlock unparalleled performance with the BB804TRL Varactor Diode from NXP Semiconductors, a trusted leader in innovation. This compact, surface-mount solution offers exceptional versatility for tuning applications in RF and communication systems. With its robust design and superior reliability, it ensures seamless operation while optimizing circuit efficiency. Elevate your projects with NXP’s commitment to quality, enhancing both functionality and value for every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it reliable for various applications.

Config: COMMON CATHODE, 2 ELEMENTS

A common cathode configuration with two elements allows for versatility in circuit design, simplifying integration and improving performance.

Surface Mount: YES

Surface mount capability facilitates automated assembly processes, allowing for compact and efficient board layouts in electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards (PCBs), making it ideal for high-density applications.

No. of Terminals: 3

Having three terminals provides flexibility in circuit design and allows for a straightforward connection for both input and output.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced footprint on the PCB, making it suitable for compact electronic designs.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of assembly and improves electrical connection stability during operation.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it offers tunable capacitance, making it essential for applications in RF and communication circuits.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability, ensuring reliable connections and maintaining performance in varying conditions.

No. of Elements: 2

With two elements, this diode can achieve a wider range of capacitance values, enhancing the performance of tuning circuits.

Diode Element Material: SILICON

Silicon as the diode element material ensures high-quality performance and efficiency, commonly used in various semiconductor applications.

Minimum Diode Capacitance Ratio: 1.65

A minimum diode capacitance ratio of 1.65 indicates a substantial variability in capacitance, making it suitable for precise tuning applications.

Technical Specifications

Varactor Diodes BB804TRL attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

1.65

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BB804TRL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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