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74LVC1G74GM,115

NXP Semiconductors

74LVC1G74GM,115 by NXP Semiconductors

74LVC1G74GM,115 by NXP Semiconductors is a CMOS latch with a fast propagation delay of 5.9 ns and operates at a nominal voltage of 3.3V. It features an automotive temperature grade, supporting -40 °C to 125 °C. Ideal for high-speed applications, it handles up to 24A current.

Median Price

$0.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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DigiKey Marketplace

USA . 1,153,510 parts In-Stock

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Chip Stock

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Vyrian

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Digiode

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Anansix

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Microchip USA

USA . 8,965 parts In-Stock

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Native Components

USA . 82 parts In-Stock

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Northwest PG Solutions

USA . 2,321 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 874 parts In-Stock

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Corphita

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Overview

Unlock the future of your designs with the 74LVC1G74GM,115 from NXP Semiconductors—a leader in high-performance solutions. This robust latch is crafted for efficiency and reliability, making it perfect for automotive applications where precision matters. Experience lightning-fast speeds, exceptional temperature tolerance, and space-saving design. Choose quality and innovation that empower your projects to excel while ensuring seamless integration and long-lasting performance. Elevate your electronics with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this latch suitable for various applications.

Propagation Delay At Nominal Supply: 5.9 ns

With a fast propagation delay, this product enhances the speed of electronic circuits, making it ideal for high-performance applications.

Surface Mount: YES

The surface mount capability allows for compact designs and improved soldering efficiency, suitable for modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space-saving on PCB, enabling more efficient circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this latch compatible with a wide range of modern digital systems.

Power Supplies (V): 3.3

Designed for 3.3V power supplies, this product supports low-voltage operation, reducing power consumption in applications.

No. of Terminals: 8

Having 8 terminals provides flexibility for various circuit connections, making integration into existing designs easier.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space usage on the PCB while maintaining operational effectiveness.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this latch can drive substantial loads, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in demanding environments, suitable for automotive and industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger enhances timing precision, suitable for synchronous and fast switching applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this latch apt for extreme environmental conditions, enhancing reliability in various scenarios.

Terminal Position: DUAL

Dual terminal position eases layout and connection options on PCBs, providing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures that the component can withstand standard soldering processes without damage.

Peak Reflow Temperature: 260 °C

The ability to withstand high peak reflow temperatures makes this product suitable for modern soldering technologies.

Temperature Grade: AUTOMOTIVE

Designed to automotive temperature standards, this latch is reliable for use in vehicles, ensuring long-term performance.

Maximum Frequency At Nominal Supply: 175000000 Hz

With a maximum frequency capability of 175 MHz, this latch supports high-speed operations in advanced digital systems.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this latch effective in energy-sensitive applications.

Terminal Form: NO LEAD

No-lead terminals enable a compact design and simplify PCB layout, facilitating high-density assembly.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for tighter layouts and smaller board designs, suitable for high-density applications.

Technical Specifications

Latches & Flip-Flops 74LVC1G74GM,115 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N8

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Trade Compliance

74LVC1G74GM,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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