Loading...

74HCT7030N,112

NXP Semiconductors

74HCT7030N,112 by NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;

Median Price

$18.484

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34 parts In-Stock

1+ parts

-

100+ parts

$16.430

1k+ parts

$14.700

10k+ parts

$13.830

34

-

$16.430

$14.700

$13.830

Verical

USA . 34 parts In-Stock

1+ parts

-

100+ parts

$20.538

1k+ parts

$18.375

10k+ parts

$17.288

34

-

$20.538

$18.375

$17.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,656 parts In-Stock

1+ parts

$8.920

100+ parts

-

1k+ parts

-

10k+ parts

-

3,656

$8.920

-

-

-

Vyrian

USA . 5,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,213

-

-

-

-

Anansix

USA . 462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

462

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 805 parts In-Stock

1+ parts

$8.451

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$8.451

-

-

-

AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$15.190

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$15.190

-

-

-

Microchip USA

USA . 435 parts In-Stock

1+ parts

$25.256

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$25.256

-

-

-

UNI Independent Distributors

Spain . 3,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,656

-

-

-

-

Northwest PG Solutions

USA . 1,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

-

-

-

-

Native Components

USA . 366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

366

-

-

-

-

Technical Specifications

FIFO 74HCT7030N,112 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

117 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 3US

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

116.28 ns

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

35.5 mm

Memory Density:

576 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

74HCT7030N,112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20