Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Width: 12.6 mm;
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$8.740
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Flash Memory MT28F400B5SG-8T attributes and parameters. Explore more Flash Memory devices from Micron Technology
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MT28F400B5SG-8T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Packaging - Standard Pkg Label Chg 20/Feb/2019
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Electronic Transistors
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148W-T
Rectron
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Telcom Semiconductor
SDSDQAF3-008G-I
Western Digital
SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
MX25L3233FM2I-08GTR
Macronix
Macronix MX25L3233FM2I-08GTR is a 32Mb NOR flash memory with SPI interface, operating at 133MHz. It offers 100K write/erase cycles, -40 to 85°C temp range, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed data storage in compact form factor.
W25Q80DVUXIE
Winbond Electronics
W25Q80DVUXIE by Winbond Electronics is a 1MX8 NOR flash memory with 104 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles endurance. It operates at -40 to 85 °C and is suitable for applications requiring high-speed data storage in compact devices.
AT45DB321D-SU-SL954
Atmel
Atmel's AT45DB321D-SU-SL954 is a 32Mbit NOR flash memory with SPI interface, operating at 66MHz. It offers 100000 write/erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring reliable data storage in a compact package.
AT45DB081D-SSU-2.5
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
MT25QU02GCBB8E12-0SIT
Micron Technology
MT25QU02GCBB8E12-0SIT by Micron Technology is a 2Gx1 Flash Memory IC with 166MHz clock frequency, operating at 1.8V. It is used in industrial applications for its 2147483648-bit memory density and serial interface, suitable for temperatures ranging from -40 to 85°C.
S25FL256LAGNFM010
Cypress Semiconductor
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
SST25VF080B-50-4C-PAE
SST25VF080B-50-4C-PAE by Microchip: 8MX1 flash memory with 8388608-bit density, SPI serial bus, and 50 MHz clock freq. Ideal for hardware/software write protection in commercial-grade applications.
S25FL032P0XMFI011
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; Maximum Seated Height: 2.159 mm;
MT25QL02GCBB8E12-0AAT
MT25QL02GCBB8E12-0AAT by Micron Technology is a 256MX8 NOR flash memory with 3V supply voltage, operating at 133MHz. It offers 100000 write/erase cycles and SPI serial bus type for industrial applications requiring high endurance and fast data transfer.
SST25VF016B-50-4I-S2AF
Silicon Storage Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2;
KLM8G1GETF-B041
Samsung
Samsung's KLM8G1GETF-B041 is an 8GX8 flash memory with 68719476736-bit density. Operating at 1.8V, it features asynchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in a compact GRID ARRAY package style.
MT25QU256ABA8E12-1SIT/TR
FLASH; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Programming Voltage (V): 1.8;
SDSDQAB-008G
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Terminal Position: UPPER;
M25P64-VME6G
STMicroelectronics
STMicroelectronics M25P64-VME6G is a NOR flash memory with 8Mx8 organization, SPI serial bus type, and 50 MHz clock frequency. It operates at -40 to 85 °C, supports 100000 write/erase cycles, and has a small outline package for industrial applications.
MX30LF2G18AC-XKI
Macronix's MX30LF2G18AC-XKI is a 256MX8 SLC NAND flash memory with 2147483648-bit density. Operating at 3V, it has an industrial temperature grade of -40 to 85°C. With a very thin profile and fine pitch grid array package, it is suitable for high-performance applications requiring reliable non-volatile memory storage.
N25Q032A13ESC40G
N25Q032A13ESC40G by Micron Technology is a NOR type flash memory with 32Mx1 organization, operating at 108MHz. It features a 3V nominal voltage and offers 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.
W25Q256JVEIQ
W25Q256JVEIQ by Winbond Electronics is a NOR flash memory with 32MX8 organization, SPI serial bus type, and 133 MHz clock frequency. It is used in industrial applications for its 100000 write/erase cycles endurance, 3.3V programming voltage, and compact rectangular package style.
SDINBDG4-16G-XI1
SDINBDG4-16G-XI1 by Western Digital is a 16GX8 MLC NAND flash memory with 17179869184 words capacity. It operates synchronously at up to 200 MHz clock frequency, offering endurance of 3000 Write/Erase cycles. Suitable for applications requiring high-density storage and fast data access in a compact form factor.
S25FL128SAGBHIA00
S25FL128SAGBHIA00 by Infineon Technologies is a 3V flash memory with 32MX4 organization, operating at 133MHz clock frequency. It features hardware/software write protection and offers 100000 Write/Erase cycles endurance. Ideal for industrial applications requiring reliable data storage in a compact GRID ARRAY package style.
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MT28EW256ABA1HPC-0SIT
Micron Technology's MT28EW256ABA1HPC-0SIT is a 16Mx16 NOR flash memory with 268MB density. Operating at 3V, it offers fast access time of 70ns for industrial applications. With a low profile grid array package, it supports asynchronous mode and parallel interface for high-speed data storage solutions.
MT28FW02GBBA1HPC-0AAT
MT28FW02GBBA1HPC-0AAT by Micron Technology is a 128MX16 flash memory with 134217728 words and 2147483648 bit memory density. Operating at -40 to 105 °C, it has a supply voltage range of 2.7V to 3.6V, making it ideal for industrial applications requiring high-speed data storage and retrieval in harsh environments.
MT28EW256ABA1LPC-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm;
MT28EW01GABA1HPC-0SIT
MT28EW01GABA1HPC-0SIT by Micron Technology is a 64MX16 Flash Memory with 67108864 words and 1073741824 bit memory density. Operating at -40 to 85 °C, it has a peak reflow temp of 260C. Ideal for industrial applications, this CMOS technology memory features parallel access with a max supply voltage of 3.6V.
MT28EW512ABA1HJS-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
MT28EW128ABA1LJS-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G56;
MT28EW128ABA1HJS-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 16;
MT28EW512ABA1HPN-0SITTR
FLASH; Peak Reflow Temperature (C): NOT SPECIFIED; Programming Voltage (V): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MT28EW512ABA1HPC-0AAT
MT28EW512ABA1HPC-0AAT by Micron Technology is a 32MX16 FLASH Memory IC with 536870912 bit memory density. Operating at 105 ns access time, it has a supply voltage range of 2.7V to 3.6V and supports asynchronous mode. Ideal for industrial applications requiring high-speed data storage in compact form factors.
MT28EW512ABA1HPC-0AATTR
FLASH; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Programming Voltage (V): 3;
MT28F800B5WG-8B
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
MT28EW256ABA1HJS-0SIT
Micron Technology's MT28EW256ABA1HJS-0SIT is a 16Mx16 NOR flash memory with 268MB density. Operating at 3V, it offers fast access time of 70ns and industrial temperature grade suitability. With parallel interface and 56 terminals in a small outline package, it finds application in high-performance embedded systems.
MT28GU01GAAA1EGC-0SIT
MT28GU01GAAA1EGC-0SIT by Micron Technology is a 64MX16 Flash Memory with 1073741824 bit memory density. Operating at 1.8V, it offers a max access time of 96ns in industrial temperature grade applications. Featuring synchronous operation and parallel interface, this thin profile GRID ARRAY package is suitable for various high-performance embedded systems.
MT28EW01GABA1LPC-0SIT
Micron Technology's MT28EW01GABA1LPC-0SIT is a 64MX16 flash memory with 67108864 words and 1073741824 bit density. Operating at 3V, it has a max access time of 95ns and supports asynchronous mode. Ideal for industrial applications, this low-profile grid array package measures 13mm x 11mm with a terminal pitch of 1mm.
MT28EW128ABA1LPC-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN SILVER COPPER;
MT28EW256ABA1HJS-0SITTR
FLASH; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Organization: 16MX16;
MT28EW128ABA1HPC-0SIT
Micron Technology's MT28EW128ABA1HPC-0SIT is an 8MX16 flash memory IC with 134217728-bit density. Operating at 3V, it offers a max access time of 70ns and supports asynchronous mode. Ideal for industrial applications, this low-profile grid array package has a rectangular shape and features parallel interface with 8388608 words capacity.
MT28EW128ABA1LPC-0SITTR
Micron Technology's MT28EW128ABA1LPC-0SITTR is a NOR flash memory with 8Mx16 organization, 2K sectors, and 64K sector size. Operating at -40 to 85°C, it offers 100000 write/erase cycles and has a standby current of 0.00012A. Ideal for industrial applications requiring fast access times and high endurance.
MT28EW512ABA1HPN-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT28F800B5WG-8BET
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
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