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MT28EW256ABA1LPC-0SIT

Micron Technology

MT28EW256ABA1LPC-0SIT by Micron Technology

Micron Technology's MT28EW256ABA1LPC-0SIT is a 16Mx16 NOR flash memory with 268MB density. Operating at 3V, it offers fast access time of 70ns for industrial applications. With parallel interface and low profile grid array package, it suits high-performance embedded systems.

Median Price

$8.650

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,022 parts In-Stock

1+ parts

$3.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

$3.850

-

-

-

Newark

USA . 1,078 parts In-Stock

1+ parts

$8.650

100+ parts

$7.480

1k+ parts

$7.030

10k+ parts

-

1,078

$8.650

$7.480

$7.030

-

Mouser Electronics

USA . 143 parts In-Stock

1+ parts

$8.650

100+ parts

$7.200

1k+ parts

$6.960

10k+ parts

$6.790

143

$8.650

$7.200

$6.960

$6.790

Arrow

USA . 2,029 parts In-Stock

1+ parts

$9.022

100+ parts

$6.926

1k+ parts

$6.657

10k+ parts

$6.317

2,029

$9.022

$6.926

$6.657

$6.317

Element14

Singapore . 2,022 parts In-Stock

1+ parts

$9.606

100+ parts

$7.739

1k+ parts

$7.508

10k+ parts

-

2,022

$9.606

$7.739

$7.508

-

Future Electronics

Canada . 5,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.780

10k+ parts

-

5,520

-

-

$4.780

-

EBV Elektronik

Germany . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,208

-

-

-

-

Verical

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.242

10k+ parts

-

921

-

-

$12.242

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 984 parts In-Stock

1+ parts

$3.658

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$3.658

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$7.490

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$7.490

-

-

-

Bristol Electronics

USA . 683 parts In-Stock

1+ parts

$12.900

100+ parts

$11.907

1k+ parts

$10.578

10k+ parts

-

683

$12.900

$11.907

$10.578

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

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BCID Electronics Ltd.

Israel . 1,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,656

-

-

-

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Vyrian

USA . 1,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,218

-

-

-

-

IBS Electronics

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$101.681

10k+ parts

-

552

-

-

$101.681

-

Cyclops Electronics Ltd

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 32 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

32

$3.080

-

-

-

Ampacity Inc.

Singapore . 1,473 parts In-Stock

1+ parts

$3.270

100+ parts

-

1k+ parts

-

10k+ parts

-

1,473

$3.270

-

-

-

Semicontronic

India . 1,076 parts In-Stock

1+ parts

$3.270

100+ parts

$3.188

1k+ parts

$3.172

10k+ parts

-

1,076

$3.270

$3.188

$3.172

-

Corphita

USA . 1,660 parts In-Stock

1+ parts

$3.465

100+ parts

-

1k+ parts

-

10k+ parts

-

1,660

$3.465

-

-

-

Corohmni

South Africa . 673 parts In-Stock

1+ parts

$5.787

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$5.787

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$7.340

100+ parts

-

1k+ parts

$7.047

10k+ parts

-

2,000

$7.340

-

$7.047

-

Continental Prestige Electronics

USA . 2,042 parts In-Stock

1+ parts

$8.430

100+ parts

$6.130

1k+ parts

-

10k+ parts

-

2,042

$8.430

$6.130

-

-

Perfect Parts

USA . 15,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,776

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-

-

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A-Z Elektronik GmbH

Germany . 8,570 parts In-Stock

1+ parts

-

100+ parts

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8,570

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-

-

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GreenTree Electronics

Israel . 3,421 parts In-Stock

1+ parts

-

100+ parts

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3,421

-

-

-

-

RC Electronics

USA . 2,629 parts In-Stock

1+ parts

-

100+ parts

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2,629

-

-

-

-

Argo Parts USA

USA . 1,881 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,881

-

-

-

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Authorized Procurement Solutions

USA . 71 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

71

-

-

-

-

Overview

Experience lightning-fast data storage and retrieval with the MT28EW256ABA1LPC-0SIT by Micron Technology. As a leading manufacturer in the industry, Micron delivers top-notch quality and reliability in their Flash Memory products. This versatile memory solution is perfect for a wide range of applications, from industrial to consumer electronics. With a wide temperature range and low profile design, this product offers exceptional value and performance for all your storage needs. Trust Micron Technology to provide the cutting-edge technology you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the memory device, ensuring longevity and reliability in various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, reducing assembly time and complexity.

Operating Mode: ASYNCHRONOUS

Enables independent and parallel operations, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage ensures stable and consistent operation of the memory device.

No. of Terminals: 64

Sufficient number of terminals for connectivity and data transfer, enhancing functionality and versatility.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature conditions, ensuring reliability in diverse settings.

Memory IC Type: FLASH

Utilizes flash memory technology for fast and efficient data storage and retrieval.

Technical Specifications

Flash Memory MT28EW256ABA1LPC-0SIT attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

70 ns

Alternate Memory Width:

8

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

64

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

31 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

11 mm

Trade Compliance

MT28EW256ABA1LPC-0SIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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