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AGLN250V5-VQG100I

Microchip Technology

AGLN250V5-VQG100I by Microchip Technology

Microchip Technology's AGLN250V5-VQG100I is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at 1.575 V, it offers a wide temperature range from -40 to 85 °C, making it suitable for industrial applications requiring high gate count and low power consumption. The package style is flatpack with thin profile and fine pitch, featuring gull wing terminals in a square shape measuring 14mm x 14mm.

Median Price

$33.080

Lifecycle Status

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7

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Mobius Materials

USA . 9 parts In-Stock

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Chip Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 836 parts In-Stock

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Semicontronic

India . 1,224 parts In-Stock

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Futuretech Components

Singapore . 4,503 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the AGLN250V5-VQG100I by Microchip Technology. This Field Programmable Gate Array (FPGA) boasts top-notch quality and reliability, perfect for a wide range of applications. Whether you're in the automotive industry, IoT, or telecommunications, this FPGA delivers unparalleled performance and flexibility. With its cutting-edge technology and user-friendly design, customers can easily customize and optimize their projects with ease. Trust in Microchip Technology to bring innovation to your fingertips with the AGLN250V5-VQG100I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and protection to the FPGA, making it durable and reliable for long-term usage.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.575 V

Having a maximum supply voltage of 1.575V ensures safe operation and protection of the FPGA components, preventing damage from overvoltage.

No. of CLBs: 6144

With a high number of Configurable Logic Blocks (CLBs), this FPGA can handle complex logic functions and designs, offering versatility and flexibility in applications.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity, making the FPGA efficient and reliable for various electronic applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing layout and design for better integration in electronic systems.

No. of Equivalent Gates: 250000

Having a large number of equivalent gates allows for the implementation of complex digital circuits and algorithms, making the FPGA suitable for high-performance computing tasks.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5V provides stable and consistent power to the FPGA, ensuring reliable operation and performance in diverse applications.

No. of Terminals: 100

With 100 terminals for connection, the FPGA offers ample opportunities for interfacing with other components and devices, enabling versatile and scalable system designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC allows for custom logic design and reconfiguration, offering flexibility and adaptability in various electronic systems and prototypes.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN250V5-VQG100I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

AGLN250V5-VQG100I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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