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AGLN060V2-VQG100I

Microchip Technology

AGLN060V2-VQG100I by Microchip Technology

Microchip Technology's AGLN060V2-VQG100I is a CMOS FPGA with 1536 CLBs and 60000 gates. Operating at 1.14-1.575 V, it is ideal for industrial applications requiring high gate count and low power consumption in a compact 14x14 mm package with GULL WING terminals.

Median Price

$18.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 90 parts In-Stock

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VNN

France . 1,222 parts In-Stock

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Vyrian

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Nova Conductors

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Digiode

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AZTECH Wire

Italy . 619 parts In-Stock

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Semicontronic

India . 7 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,076 parts In-Stock

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RGB Technical Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Futuretech Components

Singapore . 3,286 parts In-Stock

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Microchip USA

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Bastille Electronics

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Overview

Experience the power of cutting-edge technology with the AGLN060V2-VQG100I by Microchip Technology. As a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA), Microchip delivers top-quality products that are versatile and reliable. Whether you're looking to enhance your data processing capabilities or optimize your system performance, this FPGA provides unparalleled value and benefits. With 1536 CLBs and 60000 gates, along with a wide range of applications, this product is sure to meet all your needs. Upgrade your tech game today with Microchip Technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability to the FPGA, making it suitable for various applications.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for flexibility in power supply options.

No. of CLBs: 1536

Having 1536 Configurable Logic Blocks (CLBs) provides a high level of customization and flexibility in designing logic circuits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA efficient and reliable.

No. of Equivalent Gates: 60000

With 60,000 equivalent gates, this FPGA has a large capacity for complex logic designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this FPGA suitable for use in various environments, including extreme temperatures.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN060V2-VQG100I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

1536

No. of Equivalent Gates:

60000

Technology:

CMOS

Organization:

1536 CLBS, 60000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

AGLN060V2-VQG100I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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