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AGLN010V2-QNG48I

Microchip Technology

AGLN010V2-QNG48I by Microchip Technology

Microchip Technology's AGLN010V2-QNG48I is a CMOS FPGA with 260 CLBs and 10000 gates. Operating b/w -40 to 85 °C, it has a max supply voltage of 1.575 V and min of 1.14 V. Ideal for industrial applications requiring high gate count in a compact square package.

Median Price

$9.819

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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NAC Semi

USA . 2 parts In-Stock

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$6.930

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$6.280

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Digiode

USA . 100 parts In-Stock

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$12.707

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Chip Stock

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VNN

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Nova Conductors

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Semi Source

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J2 Sourcing AB

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Vyrian

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Semicontronic

India . 748 parts In-Stock

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$12.000

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$11.700

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$11.640

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748

$12.000

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Corphita

USA . 169 parts In-Stock

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$12.038

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AZTECH Wire

Italy . 496 parts In-Stock

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$16.723

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Aztec Data Supply Inc.

USA . 75 parts In-Stock

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Corohmni

South Africa . 115 parts In-Stock

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CPlus Electronics

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NIA Electronics

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RC Electronics

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LOOK Integrated Logistics

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Montano Global Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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LMD Electronica

Estonia . 2,750 parts In-Stock

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Ledger Components

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Microchip USA

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GreenTree Electronics

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the AGLN010V2-QNG48I by Microchip Technology. As a leading manufacturer in the field, Microchip guarantees top-notch quality and reliability. This Field Programmable Gate Array (FPGA) boasts 260 CLBs and 10,000 equivalent gates, offering unparalleled performance for a variety of applications. With a maximum supply voltage of 1.575V and a compact square package shape, this FPGA is perfect for industrial-grade projects. Experience seamless integration and enhanced functionality with the AGLN010V2-QNG48I, delivering exceptional value and efficiency to every customer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and reducing assembly costs.

Maximum Supply Voltage: 1.575 V

Operating within a maximum supply voltage of 1.575V ensures power efficiency and helps avoid damage to the FPGA.

No. of CLBs: 260

Having 260 configurable logic blocks provides flexibility in designing complex logic functions and circuits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and energy-efficient.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board and simplifies routing of connections.

No. of Equivalent Gates: 10000

With 10,000 equivalent gates, this FPGA can handle large and intricate logic designs with ease.

Nominal Supply Voltage (V): 1.2

Operating at a nominal supply voltage of 1.2V ensures stable performance and compatibility with standard power sources.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and ease of integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC offers customizable logic functions that can be reconfigured as needed, providing flexibility in design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles provide efficient heat dissipation and space-saving advantages.

Minimum Supply Voltage: 1.14 V

Operating at a minimum supply voltage of 1.14V allows for low-power operation and extends the lifespan of the FPGA.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperatures in industrial environments, ensuring reliability.

Pitch Of Terminal: 0.4 mm

Having a pitch of 0.4mm for terminals allows for efficient placement on the circuit board and facilitates high-density designs.

Organization: 260 CLBS, 10000 GATES

Well-organized with 260 CLBs and 10,000 gates, this FPGA offers a structured design approach for complex logic implementation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can function reliably in extreme cold environments without performance degradation.

Position Of Terminal: QUAD

Quad position of terminals allows for efficient routing and connection of signals, enhancing the overall performance of the FPGA.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this FPGA has moderate sensitivity to moisture, making it suitable for a wide range of applications without being overly susceptible to environmental factors.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this FPGA can fit into compact spaces on the circuit board, enabling efficient board layout.

Width: 6 mm

A width of 6mm provides a balance between space-saving and ease of handling during assembly and installation.

Length: 6 mm

A length of 6mm offers a compact form factor, making this FPGA suitable for applications where space is limited.

Grading Of Temperature: INDUSTRIAL

Graded for industrial temperature range, this FPGA can operate reliably in harsh environments with temperature fluctuations, ensuring long-term performance and durability.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN010V2-QNG48I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

260

No. of Equivalent Gates:

10000

Technology:

CMOS

Organization:

260 CLBS, 10000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Surface Mountable:

Yes

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

48

Standards

JESD-30 Code:

S-XQCC-N48

Qualified:

No

Trade Compliance

AGLN010V2-QNG48I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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