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AGLN250V2-CSG81I

Microchip Technology

AGLN250V2-CSG81I by Microchip Technology

Microchip AGLN250V2-CSG81I is a 6144 CLBs, 250000 gates FPGA with CMOS tech. Operates at 1.14-1.575 V, -40 to 85°C. Ideal for industrial applications requiring high gate count and low power consumption in a compact 0.5mm pitch grid array package.

Median Price

$35.550

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 6,324 parts In-Stock

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$23.540

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$22.420

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$23.540

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Master Electronics

USA . 232 parts In-Stock

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$35.550

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$27.090

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$26.820

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232

$35.550

$27.090

$26.820

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Arrow

USA . 110 parts In-Stock

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$35.970

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$21.960

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110

$35.970

$21.960

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Mouser Electronics

USA . 626 parts In-Stock

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$36.370

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$27.780

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626

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Verical

USA . 232 parts In-Stock

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$31.871

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$31.800

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$31.800

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$28.028

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$28.028

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Digiode

USA . 402 parts In-Stock

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$34.552

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$34.552

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Electro Sonic

Canada . 408 parts In-Stock

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$38.610

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$27.900

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$27.620

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408

$38.610

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$27.620

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IBS Electronics

USA . 6,862 parts In-Stock

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$48.236

100+ parts

$38.197

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$37.816

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$48.236

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$37.816

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NAC Semi

USA . 4,480 parts In-Stock

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$47.080

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$42.800

4,480

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$42.800

VNN

France . 2,370 parts In-Stock

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2,370

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Vyrian

USA . 790 parts In-Stock

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Chip Stock

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NexGen Digital

USA . 7 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,098 parts In-Stock

1+ parts

$23.150

100+ parts

$22.571

1k+ parts

$22.456

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$23.150

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$22.456

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Ampacity Inc.

Singapore . 969 parts In-Stock

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$23.150

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Continental Prestige Electronics

USA . 5,166 parts In-Stock

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$28.028

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$27.468

5,166

$28.028

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$27.468

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$28.030

100+ parts

$26.628

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$24.947

300

$28.030

$26.628

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$24.947

Corphita

USA . 461 parts In-Stock

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$32.733

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461

$32.733

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Corohmni

South Africa . 324 parts In-Stock

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$50.230

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$50.230

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Aztec Data Supply Inc.

USA . 1,088 parts In-Stock

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$99.613

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$99.613

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Advanced Electronics

New Zealand . 1,036 parts In-Stock

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$129.230

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$122.768

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$122.768

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Perfect Parts

USA . 8,622 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Fulton Briggs Corp.

USA . 2,233 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,018 parts In-Stock

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Assy Fe

Spain . 565 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock endless possibilities with the AGLN250V2-CSG81I by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) boasts 6144 CLBs and 250000 equivalent gates, providing unparalleled performance and versatility in a compact package. With a nominal supply voltage of 1.2V and advanced CMOS technology, this FPGA offers unmatched efficiency and reliability. Whether you're designing high-speed communication systems or complex industrial automation solutions, the AGLN250V2-CSG81I delivers superior quality and value, making it the ideal choice for your next project. Elevate your designs to new heights with Microchip Technology's innovative FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, making it suitable for various applications in different environments.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.575 V

Supports a high supply voltage level, making the product versatile and capable of handling different power requirements.

No. of CLBs: 6144

Offers a large number of Configurable Logic Blocks (CLBs), allowing for complex logic functions to be implemented efficiently.

Technology Used: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, enhancing the overall performance of the product.

No. of Equivalent Gates: 250000

Provides a high number of equivalent gates for implementing complex digital circuits, making it suitable for a wide range of applications.

Nominal Supply Voltage (V): 1.2

Operates at a standard nominal supply voltage level, ensuring compatibility with existing systems and components.

No. of Terminals: 81

Offers a sufficient number of terminals for connection and communication, enabling the product to interface with other components effectively.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for flexibility and reconfigurability, making it ideal for prototyping and development purposes.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Features a compact and efficient package style, optimizing space utilization and enabling high-density designs.

Minimum Supply Voltage: 1.14 V

Supports a low minimum supply voltage, allowing for power-efficient operation and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Operates reliably within a wide range of temperatures, making it suitable for industrial applications with varying environmental conditions.

Pitch Of Terminal: 0.5 mm

Offers a fine pitch terminal design for high-density mounting, enhancing the overall performance and functionality of the product.

Organization: 6144 CLBS, 250000 GATES

Clearly defines the organizational structure of the FPGA, indicating the number of CLBs and gates available for designing complex logic circuits.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, providing reliability in harsh environments where temperature fluctuations occur.

Finishing Of Terminal Used: TIN SILVER COPPER

Employs a durable and reliable terminal finishing, ensuring secure connections and preventing corrosion for long-term performance.

Position Of Terminal: BOTTOM

Utilizes a bottom terminal configuration for easy PCB layout and assembly, simplifying the integration process in electronic systems.

Moisture Sensitivity Level (MSL): 3

Indicates the device's sensitivity to moisture, helping in proper handling and storage to maintain its integrity and functionality.

Maximum Seated Height: 0.8 mm

Features a low profile design with a maximum seated height, facilitating compact and space-saving circuit board layouts.

Width: 5 mm

Defines the width dimension of the product, providing a compact form factor for integration into various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Specifies the maximum time duration for peak reflow temperature, ensuring proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow processes for surface mounting, ensuring secure and reliable solder joints for robust connections.

Length: 5 mm

Defines the length dimension of the product, contributing to its compact size and efficient utilization of available PCB space.

Grading Of Temperature: INDUSTRIAL

Indicates the product's suitability for industrial applications, meeting temperature requirements and reliability standards in demanding environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN250V2-CSG81I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

5 mm

Width:

5 mm

Maximum Seated Height:

.8 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

81

Standards

JESD-30 Code:

S-PBGA-B81

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AGLN250V2-CSG81I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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