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AGLN250V5-CSG81I

Microchip Technology

AGLN250V5-CSG81I by Microchip Technology

Microchip's AGLN250V5-CSG81I is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at 1.5V, it has a max supply voltage of 1.575V and min of 1.425V. Ideal for industrial applications requiring high gate count and low power consumption in a compact grid array package.

Median Price

$29.730

Lifecycle Status

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14

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1k+

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Arrow

USA . 344 parts In-Stock

1+ parts

$24.690

100+ parts

$21.080

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344

$24.690

$21.080

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Master Electronics

USA . 95 parts In-Stock

1+ parts

$29.330

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$22.900

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$22.670

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95

$29.330

$22.900

$22.670

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Mouser Electronics

USA . 277 parts In-Stock

1+ parts

$30.130

100+ parts

$24.340

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$24.300

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277

$30.130

$24.340

$24.300

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DigiKey

USA . 1,956 parts In-Stock

1+ parts

$33.110

100+ parts

$25.280

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$33.110

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Microchip Technology

USA . 9 parts In-Stock

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$33.110

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$25.280

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$12.200

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9

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Verical

USA . 95 parts In-Stock

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$27.282

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Nova Conductors

Japan . 600 parts In-Stock

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$23.340

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$23.340

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Electro Sonic

Canada . 128 parts In-Stock

1+ parts

$23.910

100+ parts

$19.640

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$19.060

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128

$23.910

$19.640

$19.060

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Digiode

USA . 158 parts In-Stock

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$31.103

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$31.103

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IBS Electronics

USA . 95 parts In-Stock

1+ parts

$42.902

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$34.586

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$33.898

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95

$42.902

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$33.898

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VNN

France . 1,398 parts In-Stock

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Chip Stock

USA . 1,020 parts In-Stock

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Vyrian

USA . 523 parts In-Stock

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Odi Ramu Company

Canada . 8 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,376 parts In-Stock

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$23.140

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$22.677

5,376

$23.140

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$22.677

Netroflash

USA . 50 parts In-Stock

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$23.340

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$22.173

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$21.706

50

$23.340

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$22.173

$21.706

Semicontronic

India . 10 parts In-Stock

1+ parts

$27.830

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$27.134

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$26.995

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$27.830

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$26.995

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Corphita

USA . 66 parts In-Stock

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$29.466

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Aztec Data Supply Inc.

USA . 4,720 parts In-Stock

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$42.157

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$42.157

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Corohmni

South Africa . 190 parts In-Stock

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$68.997

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Argo Parts USA

USA . 2,290 parts In-Stock

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Fulton Briggs Corp.

USA . 1,869 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 640 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Glotronic Ltd.

UK . 377 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$49.257

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$45.612

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$45.612

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$45.612

Lucentia Tech

USA . 100 parts In-Stock

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$49.257

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$45.612

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$45.612

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$49.257

$45.612

$45.612

Overview

Unlock limitless possibilities with the AGLN250V5-CSG81I by Microchip Technology, a cutting-edge Field Programmable Gate Array that boasts unparalleled quality and reliability. Manufactured by industry leader Microchip Technology, this FPGA offers 250,000 equivalent gates and 6,144 CLBs, making it ideal for a wide range of applications. Whether you're in the automotive, telecommunications, or aerospace industry, this product provides unmatched value, benefits, and advantages that will take your projects to the next level. Embrace innovation with the AGLN250V5-CSG81I and experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the FPGA lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage tolerance of 1.575 V provides flexibility in power supply options for the FPGA.

No. of CLBs: 6144

With a high number of Configurable Logic Blocks (CLBs), this FPGA offers extensive programmability and customization for complex logic operations.

Technology Used: CMOS

The use of CMOS technology ensures low power consumption and high-speed performance, making the FPGA efficient and reliable.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment on the PCB, enhancing the overall design and layout.

Form Of Terminal: BALL

The ball form of terminals ensures a secure connection and reliable electrical contact, reducing the risk of signal interference or loss.

No. of Equivalent Gates: 250000

The large number of equivalent gates allows for complex digital circuit designs and implementations, making the FPGA versatile and powerful.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5 V is within a common operating range, making it compatible with standard power sources and systems.

Packing Method: TRAY

The tray packing method ensures safe and organized storage and handling of the FPGA units, reducing the risk of damage during transportation.

No. of Terminals: 81

The high number of terminals provides ample connectivity options for interfacing with other components and devices in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC allows for on-the-fly reprogramming and customization, making it adaptable for various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enhances overall PCB real estate utilization, allowing for compact and space-efficient designs.

Minimum Supply Voltage: 1.425 V

The low minimum supply voltage requirement of 1.425 V helps in minimizing power consumption and optimizing energy efficiency for the FPGA.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature tolerance of 85°C, this FPGA can withstand elevated temperature environments without compromising performance.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density packing and efficient use of PCB space, enabling complex circuit designs in a compact form factor.

Organization: 6144 CLBS, 250000 GATES

The organizational structure of 6144 CLBs and 250000 gates provides a clear overview of the FPGA's processing capabilities and design capacity.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can function reliably in harsh and cold environments without performance degradation.

Position Of Terminal: BOTTOM

The terminal position at the bottom ensures easy access and secure attachment during integration with the PCB, enhancing overall connectivity and reliability.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate resistance to moisture exposure, making the FPGA suitable for a wide range of operating environments.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm allows for slim and compact board designs, optimizing space utilization in electronic systems.

Width: 5 mm

The narrow width of 5 mm enables efficient placement and routing on the PCB, contributing to a streamlined and organized circuit layout.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes, maintaining the integrity of the FPGA connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables reliable soldering and thermal bonding during assembly, ensuring secure attachment of the FPGA to the PCB.

Length: 5 mm

The compact length of 5 mm contributes to a space-efficient design, allowing for versatile integration and placement in various electronic systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures robust performance and reliability in demanding operating conditions, making this FPGA suitable for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN250V5-CSG81I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

5 mm

Width:

5 mm

Maximum Seated Height:

.8 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

81

Standards

JESD-30 Code:

S-PBGA-B81

Qualified:

No

Trade Compliance

AGLN250V5-CSG81I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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