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AGLN020V2-QNG68I

Microchip Technology

AGLN020V2-QNG68I by Microchip Technology

Microchip Technology's AGLN020V2-QNG68I is a 520 CLB, 20000 gates FPGA with CMOS technology. It operates b/w -40 to 85 °C and has a max supply voltage of 1.575 V. Ideal for industrial applications requiring high gate count and low power consumption.

Median Price

$16.013

Lifecycle Status

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Verical

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Master Electronics

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VNN

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Nova Conductors

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IBS Electronics

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 650 parts In-Stock

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Semicontronic

India . 122 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 74 parts In-Stock

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Montano Global Distributors

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Futuretech Components

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LMD Electronica

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Argo Parts USA

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Microchip USA

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Corphita

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Overview

Unleash the power of cutting-edge technology with the AGLN020V2-QNG68I by Microchip Technology. This Field Programmable Gate Array (FPGA) boasts top-tier quality and reliability, making it the go-to choice for a wide range of applications. With 520 CLBs and 20000 equivalent gates, this FPGA delivers unmatched performance and flexibility. Whether you're designing high-speed communication systems or advanced industrial automation solutions, this versatile product offers exceptional value and benefits. Trust Microchip Technology to provide you with the tools you need to bring your innovative ideas to life.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted makes this FPGA easy to integrate into various electronic systems, saving space and making the manufacturing process more efficient.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for flexibility in power supply design and compatibility with a wide range of applications.

No. of CLBs: 520

With 520 configurable logic blocks, this FPGA offers a high level of customization and functionality for complex digital circuit designs.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making this FPGA efficient and reliable.

Package Shape: SQUARE

The square package shape is sturdy and easy to handle, providing a stable and secure mounting option for the FPGA.

No. of Equivalent Gates: 20000

With 20,000 equivalent gates, this FPGA can handle complex logic operations and algorithms, making it suitable for a wide range of applications.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V provides a stable operating voltage for the FPGA while optimizing power efficiency.

No. of Terminals: 68

Having 68 terminals allows for multiple connection options and flexibility in circuit design, enabling integration with various electronic components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) means that this IC can be quickly reprogrammed and customized for different functions, offering versatility and adaptability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles available for this FPGA offer different mounting and cooling options, catering to different application requirements and environments.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low-power conditions, making this FPGA suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high-temperature environments, enhancing its reliability and durability.

Pitch Of Terminal: 0.4 mm

The small pitch of 0.4 mm between terminals allows for compact and high-density circuit board layouts, saving space and enabling more functionality in a limited area.

Organization: 520 CLBS, 20000 GATES

The organization of 520 configurable logic blocks and 20,000 gates provides a balance between flexibility and complexity, making this FPGA suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can function in extremely cold conditions, ensuring reliability in harsh environments.

Position Of Terminal: QUAD

The quad position of terminals simplifies installation and connection processes, reducing the chance of errors and improving overall usability of the FPGA.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this FPGA can withstand moderate exposure to moisture during manufacturing and operation, ensuring reliability in humid conditions.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for compact and low-profile designs, making this FPGA suitable for space-constrained applications.

Width: 8 mm

The 8 mm width provides a balance between compactness and ease of handling, making this FPGA versatile and suitable for various mounting options.

Length: 8 mm

The 8 mm length offers a square form factor, which is stable and easy to mount, ensuring secure placement and reliability in electronic systems.

Grading Of Temperature: INDUSTRIAL

Being graded for industrial temperature ranges means that this FPGA can operate reliably in harsh industrial environments, making it suitable for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGLN020V2-QNG68I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

520

No. of Equivalent Gates:

20000

Technology:

CMOS

Organization:

520 CLBS, 20000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Surface Mountable:

Yes

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

68

Standards

JESD-30 Code:

S-XQCC-N68

Qualified:

No

Trade Compliance

AGLN020V2-QNG68I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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