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XE169FH200F100LABKXQSA1

Infineon Technologies

XE169FH200F100LABKXQSA1 by Infineon Technologies

Infineon XE169FH200F100LABKXQSA1 is a 16-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 30 ADC channels, CAN and USIC connectivity, and 114688 bytes of RAM.

Median Price

$24.440

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 280 parts In-Stock

1+ parts

$24.440

100+ parts

$22.970

1k+ parts

$20.770

10k+ parts

-

280

$24.440

$22.970

$20.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 60 parts In-Stock

1+ parts

$23.218

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$23.218

-

-

-

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$24.273

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$24.273

-

-

-

Vyrian

USA . 6,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,025

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$17.679

100+ parts

-

1k+ parts

-

10k+ parts

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525

$17.679

-

-

-

Ampacity Inc.

Singapore . 189 parts In-Stock

1+ parts

$20.770

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$20.770

-

-

-

Corphita

USA . 638 parts In-Stock

1+ parts

$21.996

100+ parts

-

1k+ parts

-

10k+ parts

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638

$21.996

-

-

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Modulus Dynamics

Lithuania . 1,183 parts In-Stock

1+ parts

$45.966

100+ parts

$44.127

1k+ parts

$42.289

10k+ parts

-

1,183

$45.966

$44.127

$42.289

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Microchip USA

USA . 1,512 parts In-Stock

1+ parts

$53.584

100+ parts

-

1k+ parts

-

10k+ parts

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1,512

$53.584

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-

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,000

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Lixinc

USA . 5,953 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,953

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$23.787

1k+ parts

$23.059

10k+ parts

$22.574

1,000

-

$23.787

$23.059

$22.574

Overview

Discover the power of the XE169FH200F100LABKXQSA1 microcontroller by Infineon Technologies! With a focus on quality and reliability, Infineon is a trusted manufacturer in the industry. This versatile microcontroller is perfect for automotive applications, offering advanced features like PWM channels, ADC channels, and connectivity options such as CAN and USIC. Experience seamless performance and innovative design with the XE169FH200F100LABKXQSA1 - a solution that brings value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

This makes installation easy and efficient, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power options, increasing versatility in application.

Address Bus Width: 24

Wide address bus allows for efficient data transmission and processing capabilities.

Package Shape: SQUARE

Square shape allows for compact and space-saving design integration.

Bit Size: 16

16-bit architecture provides a good balance of performance and cost for various applications.

No. of Terminals: 176

High number of terminals enable connectivity to a wide range of external components.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

These package styles offer flexibility and compatibility for diverse mounting options.

Minimum Supply Voltage: 3 V

Lower minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme conditions without compromising functionality.

ADC Channels: YES

Built-in Analog-to-Digital Converters offer flexibility for interfacing with analog sensors and peripherals.

Terminal Position: QUAD

Quad terminal position provides secure connectivity and helps in avoiding signal interference.

ROM Words: 1638400

Large ROM memory capacity allows for storing extensive program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile design is suitable for space-constrained applications.

Width: 24 mm

Compact width makes it easy to incorporate into various system designs.

External Data Bus Width: 16

Wide data bus width enables faster data transfer and processing speeds.

Peripherals: POR, RTC, TIMER(8), WDT

Multiple peripherals offer additional functionality for comprehensive system control.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for quick data processing and response times.

Length: 24 mm

Compact length ensures efficient placement and integration in different setups.

Temperature Grade: AUTOMOTIVE

Automotive-grade ensures reliability and performance in demanding automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design provides efficient processing capabilities.

RAM Bytes: 114688

Ample RAM capacity supports multitasking and data storage requirements.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form offers strong connection and ease of soldering.

Analog To Digital Convertors: 30-Ch 10-Bit

Multiple ADC channels provide versatile analog signal processing capabilities.

Nominal Supply Voltage: 3.3 V

Standard supply voltage offers compatibility and ease of integration in various setups.

PWM Channels: YES

Pulse Width Modulation channels enable precise control over connected devices.

Connectivity: CAN(6), USIC(10)

Multiple connectivity options allow for seamless integration with various communication protocols.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for updating and modifying stored data.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact layouts.

Speed: 100 rpm

100 rotations per minute operational speed enhances performance in dynamic applications.

On Chip Program ROM Width: 8

Wide on-chip ROM width provides ample storage for program instructions.

No. of I/O Lines: 147

High number of I/O lines enable efficient interfacing with external components and peripherals.

Technical Specifications

Microcontrollers XE169FH200F100LABKXQSA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

114688

ROM Words:

1638400

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), USIC(10)

Peripherals:

POR, RTC, TIMER(8), WDT

Analog To Digital Convertors:

30-Ch 10-Bit

Trade Compliance

XE169FH200F100LABKXQSA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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