Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
Median Price
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Suppliers In-Stock
6
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1k+
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1+ parts
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1k+ parts
10k+ parts
ComSIT Distribution GmbH
ComSIT USA
Vyrian
Digiode
J2 Sourcing AB
Modulus Dynamics
$15.912
$15.276
$14.639
AZTECH Wire
$20.780
QUARKTWIN TECHNOLOGY LTD
Perfect Parts
iodParts Technologies Inc.
$0.905
Microchip USA
Corphita
Network Interfaces TLE6251DSXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
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Telecom IC Type:
Terminal Finish:
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Width:
TLE6251DSXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - DK OBS NOTICE
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022 Mult Dev Label Chgs 11/Jan/2018
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
Dc Components
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0540T1G
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
DP83848YBX/NOPB
DP83848YBX/NOPB by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate, operating at temperatures from -40 to 125 °C. It features a 3.3 V supply voltage, quad terminal position, and CMOS technology. Ideal for automotive applications due to its low profile and fine pitch package style.
ISOW1044BDFMR
ISOW1044BDFMR by Texas Instruments is a CAN FD transceiver with 5 Mbps data rate, operating b/w -40 to 125°C. It features a small outline package with 20 terminals and requires 211 mA supply current at 5V. Ideal for network interfaces in various applications requiring high-speed communication in harsh environments.
88E6352-A1-TFJ2I000
Marvell Technology
Marvell's 88E6352-A1-TFJ2I000 is a network interface IC with 128 terminals in a square flatpack package. It features Ethernet transceiver technology, suitable for telecom applications. The IC is surface mountable and has gull wing terminals, making it ideal for various networking solutions.
SN65HVD233SHKJ
SN65HVD233SHKJ by Texas Instruments is a network interface IC with 8 terminals, operating at 3.3V and supporting data rates up to 1 Mbps. It is designed for military-grade applications, with a temperature range from -55°C to 210°C, making it suitable for harsh environments requiring reliable communication. The package style is flatpack, featuring a ceramic and metal-sealed co-fired body for durability in surface-mount configurations.
LAN8710AI-EZK-ABC
LAN8710AI-EZK-ABC by Microchip: Ethernet transceiver with 100 Mbps data rate, operates in -40 to 85 °C range. Features 32 terminals in a square chip carrier package for industrial applications. TS 16949 screening level ensures high quality and reliability.
MAX13054ASA+
Maxim Integrated
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
AR8033-AL1A-R
Qualcomm
Qualcomm's AR8033-AL1A-R is a network interface chip with 48 terminals and a square package shape. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 1000 Mbps. This Ethernet transceiver is commonly used in commercial applications requiring high-speed networking capabilities.
DP83848JSQ/NOPB
DP83848JSQ/NOPB by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate, operating at 3.3V. It features a quad terminal position, CMOS technology, and operates b/w 0-70°C. Ideal for network interfaces in commercial-grade applications due to its compact square chip carrier package style.
TJA1055T/3/CM,118
NXP Semiconductors
NXP Semiconductors' TJA1055T/3/CM,118 is a 14-terminal network interface IC with 5V supply voltage and 21mA max current. It features a small outline package shape, gull wing terminals, and dual position. Ideal for telecom applications requiring interface circuitry in compact designs.
PCA82C251TD
NXP Semiconductors' PCA82C251TD is a CAN transceiver with 5V supply voltage, 78mA max supply current, and -40 to 125°C operating temperature range. Ideal for automotive applications, it features a small outline package with dual terminals and nickel/palladium/gold finish.
MCP2562T-E/MFVAO
MCP2562T-E/MFVAO by Microchip Technology is a CAN transceiver with 1 Mbps data rate. It operates at temperatures ranging from -40 to 125 °C and has a max supply current of 70 mA. This network interface is commonly used in automotive applications.
ADM3054BRWZ-RL7
Analog Devices
ADM3054BRWZ-RL7 by Analog Devices is a network interface with 16 terminals, operating at -40 to 125°C. It has a supply voltage of 3.3V, data rate of 1 Mbps, and is an Ethernet transceiver for automotive applications. The package is small outline, surface mountable, with a rectangular shape and Gull Wing terminals.
LTC2875IDD#PBF
LTC2875IDD#PBF by Analog Devices is a BICMOS technology interface circuit with 8 terminals, operating b/w -40 to 85°C. It has a small outline package style and matte tin terminal finish, suitable for telecom applications requiring a nominal voltage of 3.3V.
MAX3051EKA+T
Analog Devices' MAX3051EKA+T is a BICMOS technology network interface IC with 8 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and is ideal for industrial applications requiring low profile, small outline packages in telecom interface circuits.
MCP2542FDT-E/MNY
MCP2542FDT-E/MNY by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, with a supply voltage of 5V and max current of 140mA. The package is small outline, heat sink, very thin profile measuring 3x2mm in size.
DP83848CVV
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
USB3300-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ8081RNAIA
KSZ8081RNAIA by Microchip Technology is a surface mount Ethernet transceiver with 1 function and 24 terminals. It operates at temperatures ranging from -40 to 85°C and has a data rate of 100 Mbps. This IC is commonly used in network interfaces for industrial applications.
TJA1050T/VM,518
NXP Semiconductors' TJA1050T/VM,518 is a Network Interface IC with 1Mbps data rate and 5V supply voltage. It features CMOS technology, operates in automotive temperature grade (-40 to 125°C), and has a small outline package style. Ideal for interface circuits in automotive applications due to its low power consumption of 0.075mA.
ADM3057EBRWZ-RL
ADM3057EBRWZ-RL by Analog Devices is a Network Interface IC with 20 terminals, operating b/w -40 to 105°C. It features Gull Wing terminals, 5V supply voltage, and small outline package style. Ideal for industrial applications requiring interface circuitry in compact spaces.
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TLE6250GV33XUMA1
Infineon Technologies
TLE6250GV33XUMA1 by Infineon Technologies is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its surface mount capability and gull wing terminal form.
TLE6250GV33
TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.
TLE6250GV33XT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
TLE6250GXUMA1
TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.
TLE6250GV33NT
TLE6250GV33NT by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6250GV33NTMA1
TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6251DSXUMA2
TLE6251DSXUMA2 by Infineon is a small outline network interface IC with 8 terminals, 5V supply voltage, and AEC-Q100 screening. It has a gull wing terminal form, tin finish, and is suitable for telecom applications due to its interface circuit design.
TLE62512GXUMA3
TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.
TLE62513GXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2A;
TLE6251DXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE6250GXT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE6250G
TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.
TLE62543GXUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TLE6251-2G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
TLE62512GXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
TLE6250GNT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE6250CX3MA2
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
TLE6250GNTMA1
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE6250RV33
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE6250CV33
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
Supply Digital Components
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12,000 In-Stock
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