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IKD10N60RF

Infineon Technologies

IKD10N60RF by Infineon Technologies

IKD10N60RF by Infineon is an N-CHANNEL IGBT with VCEsat of 2.5V, IC of 20A, and Pmax of 150W. Ideal for POWER CONTROL applications due to its fast turn-off time (toff) of 186ns and built-in diode configuration. Operates in temperatures ranging from -40 to 175°C, making it suitable for various power control systems.

Median Price

$1.820

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,571 parts In-Stock

1+ parts

$1.820

100+ parts

$0.769

1k+ parts

$0.552

10k+ parts

$0.501

4,571

$1.820

$0.769

$0.552

$0.501

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 291 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$1.530

-

-

-

Vyrian

USA . 838 parts In-Stock

1+ parts

$1.610

100+ parts

-

1k+ parts

-

10k+ parts

-

838

$1.610

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 158 parts In-Stock

1+ parts

$1.449

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$1.449

-

-

-

Modulus Dynamics

Lithuania . 15,980 parts In-Stock

1+ parts

$1.484

100+ parts

$1.425

1k+ parts

$1.365

10k+ parts

-

15,980

$1.484

$1.425

$1.365

-

Perfect Parts

USA . 5,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,551

-

-

-

-

Microchip USA

USA . 4,320 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,320

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,500

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-

-

Overview

Unlock the power of efficient and reliable power control with the IKD10N60RF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and performance in their Insulated Gate Bipolar Transistors (IGBT). Ideal for a variety of applications, this N-CHANNEL transistor offers a built-in diode for added convenience. With a maximum VCEsat of 2.5V and a maximum operating temperature of 175°C, this transistor ensures optimal performance and durability. Trust Infineon to provide you with a high-quality solution that will meet your power control needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the components inside.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer better performance and efficiency compared to P-channel ones.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can save space on the PCB.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance under high power conditions.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, especially in mass production.

Maximum VCEsat: 2.5 V

Low VCEsat helps in reducing power losses and improving efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to mount and secure on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and are suitable for automated pick and place assembly.

Nominal Turn Off Time (toff): 186 ns

Fast turn off time ensures quick switching and improves overall performance of the power control circuit.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability allows the IGBT to handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is ideal for compact designs.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability in demanding environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High maximum VCE voltage rating allows the IGBT to be used in high voltage applications.

Transistor Element Material: SILICON

Silicon material offers good thermal and electrical properties, making it suitable for power control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage allows for reliable gate control and switching.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IGBT to function in a wide range of environmental conditions.

Maximum Collector Current (IC): 20 A

High maximum collector current rating allows the IGBT to handle high current loads.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Low gate-emitter threshold voltage ensures efficient switching and control of the IGBT.

Terminal Finish: TIN

Tin terminal finish provides good solderability and ensures reliable connections.

Terminal Position: SINGLE

Single terminal position simplifies the installation process.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation from the device.

Nominal Turn On Time (ton): 27 ns

Fast turn on time ensures quick response and efficient operation of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD10N60RF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

186 ns

Nominal Turn On Time (ton):

27 ns

Maximum VCEsat:

2.5 V

Trade Compliance

IKD10N60RF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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