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IKD15N60RFXT

Infineon Technologies

IKD15N60RFXT by Infineon Technologies

IKD15N60RFXT by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 30A max collector current. It has a turn-off time of 193ns and turn-on time of 30ns, suitable for power control applications. The transistor comes in a small outline package with gull wing terminals, making it ideal for surface mount configurations.

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3

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1k+

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Digiode

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Vyrian

USA . 572 parts In-Stock

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Nova Conductors

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Modulus Dynamics

Lithuania . 10,658 parts In-Stock

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$1.234

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$1.185

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$1.135

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AZTECH Wire

Italy . 569 parts In-Stock

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$6.632

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Ampacity Inc.

Singapore . 948 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 600 parts In-Stock

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Overview

Elevate your power control capabilities with the IKD15N60RFXT from Infineon Technologies, a leading manufacturer in the industry. This Insulated Gate Bipolar Transistor (IGBT) boasts quality construction and a built-in diode for added convenience. Ideal for a wide range of applications, this N-CHANNEL transistor offers fast turn-on and turn-off times, ensuring efficient power control. With a maximum collector-emitter voltage of 600V and a collector current of 30A, this IGBT is a reliable choice for your power management needs. Experience the value and benefits this product brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IGBT, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses, higher efficiency, and faster switching speeds compared to P-channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves the overall efficiency and performance of the IGBT in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in controlling high power levels.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying the assembly process.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and enhance the mechanical strength of the IGBT when soldered on the PCB.

Minimum Operating Temperature: -40 °C

Capable of operating in a wide range of temperatures, making it suitable for various industrial and environmental conditions.

Maximum Collector Current (IC): 30 A

Can handle high current levels, making it suitable for applications that require high-power switching and control.

Nominal Turn On Time (ton): 30 ns

Fast turn-on time ensures quick switching speeds, reducing switching losses and improving overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD15N60RFXT attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

193 ns

Nominal Turn On Time (ton):

30 ns

Trade Compliance

IKD15N60RFXT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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