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IKD15N60RFAATMA1

Infineon Technologies

IKD15N60RFAATMA1 by Infineon Technologies

IKD15N60RFAATMA1 by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 30A max collector current. It has a turn-off time of 193ns and turn-on time of 30ns, ideal for power control applications. This surface-mount transistor in a rectangular package is AEC-Q101 compliant for automotive use.

Median Price

$1.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 4,914 parts In-Stock

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$1.090

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$1.090

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Nova Conductors

Japan . 50 parts In-Stock

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$1.500

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$1.500

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Vyrian

USA . 4,793 parts In-Stock

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4,793

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Digiode

USA . 595 parts In-Stock

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Ampacity Inc.

Singapore . 4,568 parts In-Stock

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$0.930

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$0.930

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Continental Prestige Electronics

USA . 5,192 parts In-Stock

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$1.500

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$1.470

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Argo Parts USA

USA . 2,984 parts In-Stock

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$1.500

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Netroflash

USA . 100 parts In-Stock

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$1.500

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Modulus Dynamics

Lithuania . 22,782 parts In-Stock

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$1.884

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$1.809

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$1.733

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Microchip USA

USA . 9,411 parts In-Stock

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Corphita

USA . 693 parts In-Stock

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Overview

Unlock the power of Infineon Technologies with the IKD15N60RFAATMA1 Insulated Gate Bipolar Transistor. Designed for reliable performance in power control applications, this N-channel transistor offers a wide range of benefits to customers. With a maximum collector-emitter voltage of 600V and a built-in diode configuration, this transistor delivers exceptional quality and efficiency. Whether you're looking for a solution for industrial machinery or automotive systems, Infineon Technologies has you covered with this high-quality product. Upgrade your power control systems today with the IKD15N60RFAATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drop and faster switching speeds, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the overall efficiency of power control systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling high power loads.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, making installation and maintenance hassle-free.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy integration into existing circuit designs.

Nominal Turn Off Time (toff): 193 ns

Fast turn-off time improves efficiency and reduces switching losses in power control applications.

No. of Terminals: 2

Simple two-terminal connection simplifies the installation process and reduces the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space on the PCB and allows for high-density mounting of components.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating makes it suitable for use in a wide range of power control applications, providing versatility and reliability.

Transistor Element Material: SILICON

Silicon material offers good thermal stability and high switching speeds, ensuring consistent performance under varying operating conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in both extreme cold and hot environments.

Maximum Collector Current (IC): 30 A

High collector current rating enables the control of large power loads, making it suitable for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and ensures consistent performance in power control systems.

Case Connection: COLLECTOR

Collector connection allows for efficient heat dissipation, helping to maintain optimal operating temperatures during high-power operation.

Nominal Turn On Time (ton): 30 ns

Fast turn-on time enables quick response in power control systems, improving overall efficiency and performance.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standards ensures high quality, reliability, and durability, making it suitable for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD15N60RFAATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

193 ns

Nominal Turn On Time (ton):

30 ns

Trade Compliance

IKD15N60RFAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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