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BSC010N04LSCATMA1

Infineon Technologies

BSC010N04LSCATMA1 by Infineon Technologies

BSC010N04LSCATMA1 by Infineon is a N-CHANNEL FET with 40V DS Breakdown Voltage, 1128A IDM, and 0.00135 ohm Drain-Source On Resistance. Ideal for power applications requiring high drain current handling and low on-resistance in a small outline package.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$1.800

100+ parts

-

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750

$1.800

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Vyrian

USA . 4,796 parts In-Stock

1+ parts

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4,796

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VNN

France . 837 parts In-Stock

1+ parts

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837

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Digiode

USA . 471 parts In-Stock

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471

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,215 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

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10k+ parts

$1.764

6,215

$1.800

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-

$1.764

Argo Parts USA

USA . 4,556 parts In-Stock

1+ parts

$1.800

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4,556

$1.800

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$1.800

100+ parts

$1.710

1k+ parts

$1.624

10k+ parts

$1.602

40

$1.800

$1.710

$1.624

$1.602

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.836

100+ parts

$1.836

1k+ parts

$1.836

10k+ parts

-

600

$1.836

$1.836

$1.836

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Microchip USA

USA . 5,335 parts In-Stock

1+ parts

$11.500

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5,335

$11.500

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AZTECH Wire

Italy . 572 parts In-Stock

1+ parts

$13.034

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572

$13.034

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Ampacity Inc.

Singapore . 741 parts In-Stock

1+ parts

$37.050

100+ parts

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741

$37.050

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Corphita

USA . 831 parts In-Stock

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831

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$14.891

1k+ parts

$14.891

10k+ parts

$14.891

100

-

$14.891

$14.891

$14.891

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$14.891

1k+ parts

$14.891

10k+ parts

$14.891

100

-

$14.891

$14.891

$14.891

Overview

Unleash the power of innovation with the BSC010N04LSCATMA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors (FET) that are versatile and reliable. This N-CHANNEL transistor, with a single configuration and built-in diode, offers exceptional performance for a wide range of applications. Whether you need enhanced power efficiency or robust circuit protection, this FET is designed to meet your needs. Experience the value and benefits of Infineon's cutting-edge technology with the BSC010N04LSCATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to physical damage, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-resistance and higher mobility, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse polarity, enhancing the reliability of the product.

Maximum Drain-Source On Resistance: 0.00135 ohm

Low ON resistance results in minimal power loss and higher efficiency in power applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the FET to function reliably in various environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) BSC010N04LSCATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

330 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

248 A

Maximum Drain-Source On Resistance:

.00135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

320 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1128 A

Reference Standard:

IEC-61249-2-21; IEC-68-1

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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