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BAR63-02W-E6327

Infineon Technologies

BAR63-02W-E6327 by Infineon Technologies

PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .3 pF; Maximum Operating Temperature: 125 Cel; Minimum Breakdown Voltage: 50 V; Diode Resistive Test Frequency: 100 MHz;

Median Price

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Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 331,515 parts In-Stock

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331,515

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ComSIT USA

USA . 331,515 parts In-Stock

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331,515

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Vyrian

USA . 5,169 parts In-Stock

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5,169

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Odintec Ltd.

Israel . 3,000 parts In-Stock

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3,000

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Speed Components Ltd

Israel . 2,900 parts In-Stock

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2,900

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ACDS - Activité Composants Distribution Service

France . 2,844 parts In-Stock

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Dan-Mar Components

USA . 2,844 parts In-Stock

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LWI Electronics Inc

India . 2,800 parts In-Stock

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2,800

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,750 parts In-Stock

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PC Components Company LLC

USA . 2,256 parts In-Stock

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Bristol Electronics

USA . 2,256 parts In-Stock

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DF Sales Co.

USA . 2,010 parts In-Stock

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DF Sales Co.

USA . 2,010 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,886 parts In-Stock

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J2 Sourcing AB

Sweden . 1,750 parts In-Stock

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ECAB

Sweden . 1,336 parts In-Stock

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Sinequanon

UK . 400 parts In-Stock

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400

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Digiode

USA . 40 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 23,983 parts In-Stock

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$0.158

100+ parts

$0.152

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$0.145

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23,983

$0.158

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Native Components

USA . 990 parts In-Stock

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$0.801

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990

$0.801

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Northwest PG Solutions

USA . 1,077 parts In-Stock

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$0.881

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AZTECH Wire

Italy . 1,162 parts In-Stock

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$12.160

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A-Z Elektronik GmbH

Germany . 14,790 parts In-Stock

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Microchip USA

USA . 5,811 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Kepictronics

USA . 3,120 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Corphita

USA . 528 parts In-Stock

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528

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Technical Specifications

PIN Diodes BAR63-02W-E6327 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

50 V

Nominal Diode Capacitance:

.3 pF

Maximum Diode Forward Resistance:

2 ohm

Diode Resistive Test Current:

5 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Nominal Minority Carrier Lifetime:

.075 us

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

125 Cel

Peak Reflow Temperature (C):

260

Reverse Test Voltage:

5 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Trade Compliance

BAR63-02W-E6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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