Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's BAR6305WH6327XTSA1 is a PIN diode with common cathode, 2 elements, and 0.3 pF capacitance. Ideal for S band applications, it features a max operating temperature of 150°C and forward resistance of 2 ohm. Suitable for switching purposes due to its positive-intrinsic-negative technology and small outline package style.
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This material is durable and reliable, providing protection for the diodes inside the package.
Common cathode configuration simplifies circuit design and ensures consistent performance across both elements.
Designed for use in the S band frequency range, making it suitable for a wide range of applications.
Surface mount capability makes installation easy and saves space on the circuit board.
Low diode capacitance ensures high-frequency performance and minimal signal loss.
Rectangular shape is space-efficient and easy to handle during assembly.
Having 3 terminals allows for flexibility in circuit connections and configurations.
Small outline package style saves space on the circuit board and is easy to handle.
Designed for use in switching applications, ensuring fast and efficient signal control.
High maximum operating temperature allows for reliable performance in various environments.
Tin terminal finish provides good conductivity and corrosion resistance.
Dual terminal position allows for easy connections and ensures stable performance.
Low forward resistance minimizes power loss and ensures efficient signal transmission.
With a maximum power dissipation of 0.25 W, this product can handle high power levels without overheating.
Short minority carrier lifetime ensures fast response times and efficient signal switching.
High breakdown voltage provides protection against voltage spikes and ensures long-term reliability.
PIN diodes are known for their high-speed switching capabilities and low distortion, making them ideal for various applications.
This technology allows for precise control of the diode's behavior, ensuring consistent performance.
Gull wing terminal form is suitable for surface mount applications, providing secure connections and easy installation.
Having 2 elements allows for versatility in circuit design and applications.
Silicon diode element material offers reliable performance and stability over a wide range of temperatures.
PIN Diodes BAR6305WH6327XTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies
Application:
Minimum Breakdown Voltage:
Config:
Maximum Diode Capacitance:
Diode Element Material:
Maximum Diode Forward Resistance:
Diode Type:
Frequency Band:
JESD-30 Code:
JESD-609 Code:
Nominal Minority Carrier Lifetime:
Moisture Sensitivity Level (MSL):
No. of Elements:
No. of Terminals:
Maximum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Maximum Power Dissipation:
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Technology:
Terminal Finish:
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BAR6305WH6327XTSA1 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8541.10.00.80
SB
PCN Packaging - Reel Cover Tape Chg 16/Feb/2016
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADW
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
Diotec Semiconductor Ag
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
NE555D
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
Goodwork Semiconductor
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
BAP50-02T/R
NXP Semiconductors
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR64-02W
Infineon Technologies
1SV307(TPH3,F)
Toshiba
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 10 mA; Maximum Operating Temperature: 125 Cel; Maximum Diode Forward Resistance: 1.5 ohm; Diode Resistive Test Frequency: 1 MHz;
BAP27-01
BAP55L,315
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
933410710215
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
HSMP-3824-BLK
Agilent Technologies
1SV172
SP000742896
BAR67-02V-H6327
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: .7 us; Reverse Test Voltage: 5 V; Moisture Sensitivity Level (MSL): 1; Nominal Diode Capacitance: .35 pF;
MPL4700-206-HS
Microchip Technology
MPL4700-206-HS by Microchip Technology is a single PIN diode with ultra high frequency to X band range. Featuring 0.15 pF diode capacitance, it operates b/w -55°C to 150°C. Ideal for applications requiring low forward resistance and breakdown voltage of 25V, such as RF switches and attenuators.
BXY43T1PZZZA1
PIN DIODE; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
BAR89-02LRH-E6327
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Minimum Breakdown Voltage: 80 V; Moisture Sensitivity Level (MSL): 1; Maximum Diode Forward Resistance: 1.5 ohm;
BAR63-05W-E6327
PIN DIODE; Surface Mount: YES; Config: COMMON CATHODE, 2 ELEMENTS; Reverse Test Voltage: 5 V; Nominal Minority Carrier Lifetime: .075 us; Diode Resistive Test Frequency: 100 MHz;
1SV308(TPL3,F)
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 10 mA; Maximum Operating Temperature: 125 Cel; Reverse Test Voltage: 1 V; Maximum Diode Forward Resistance: 1.5 ohm;
BAP51LX
PIN DIODE; Terminal Position: DUAL; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBV3401LT3G
MMBV3401LT3G by Onsemi is a PIN diode with a max forward resistance of 0.7 ohm, ideal for high-frequency switching applications. It operates at up to 125 °C, has a breakdown voltage of 35V, and features a small outline package style for surface mount assembly.
BAP1321-01
BAR6306E6327HTSA1
BAR65-02V-E6327
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Diode Resistive Test Current: 5 mA; Nominal Minority Carrier Lifetime: .08 us; Nominal Diode Capacitance: .5 pF;
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BAR6302VH6327XTSA1
Infineon's BAR6302VH6327XTSA1 is a PIN diode with 0.3 pF capacitance, 2 ohm forward resistance, and 50 V breakdown voltage. It operates in S Band frequencies for switching applications. With a temperature range of -55 to 125 °C, it's ideal for high-performance RF systems requiring fast response times.
BAR6503WE6327HTSA1
PIN DIODE; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
BAR6405E6327HTSA1
Infineon Technologies' BAR6405E6327HTSA1 is a PIN diode with common cathode configuration and 2 elements. It operates in the C band frequency range and has a max diode capacitance of 0.35 pF. This diode is commonly used as an attenuator or for switching applications.
BAR6404E6327HTSA1
PIN DIODE; Terminal Finish: TIN; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3;
BAR6404WH6327XTSA1
PIN DIODE; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 1; Diode Element Material: SILICON; Technology: POSITIVE-INTRINSIC-NEGATIVE; JESD-609 Code: e3;
BAR66E6327HTSA1
BAR6403WE6327HTSA1
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
BAR6402VH6327XTSA1
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Diode Element Material: SILICON;
BAR6305E6327HTSA1
BAR6502VH6327XTSA1
PIN DIODE; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
BAR6302VH6327XT
BAR6303WE6327HTSA1
Infineon's BAR6303WE6327HTSA1 is a PIN diode with 0.3 pF capacitance, 2 ohm forward resistance, and 50 V breakdown voltage. Ideal for S Band applications like switching due to its small outline package and high operating temperature of 150°C.
BAR6304WH6327XTSA1
BAR6403WE6327XT
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR63-02V-E6327
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 5 V; Diode Resistive Test Current: 5 mA; Minimum Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
BAR6304E6327HTSA1
BAR64-02V-H6327
PIN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 125 Cel;
BAR65-02V-H6327
Infineon's BAR65-02V-H6327 is a PIN diode with low forward resistance of 0.95 ohm, ideal for high-frequency applications at 100 MHz. With a reverse test voltage of 0 V and operating temperature up to 125°C, it suits RF switches and attenuators in surface-mount designs.
BAR61E6327HTSA1
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR63-02V-H6327
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