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BAR6305WH6327XTSA1

Infineon Technologies

BAR6305WH6327XTSA1 by Infineon Technologies

Infineon's BAR6305WH6327XTSA1 is a PIN diode with common cathode, 2 elements, and 0.3 pF capacitance. Ideal for S band applications, it features a max operating temperature of 150°C and forward resistance of 2 ohm. Suitable for switching purposes due to its positive-intrinsic-negative technology and small outline package style.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 769 parts In-Stock

1+ parts

$0.197

100+ parts

$0.112

1k+ parts

$0.097

10k+ parts

-

769

$0.197

$0.112

$0.097

-

Mouser Electronics

USA . 8,052 parts In-Stock

1+ parts

$0.470

100+ parts

$0.134

1k+ parts

$0.102

10k+ parts

$0.071

8,052

$0.470

$0.134

$0.102

$0.071

Chip1Stop

Japan . 12,000 parts In-Stock

1+ parts

-

100+ parts

$0.175

1k+ parts

$0.089

10k+ parts

$0.057

12,000

-

$0.175

$0.089

$0.057

Arrow

USA . 9,000 parts In-Stock

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$0.059

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$0.059

Verical

USA . 6,000 parts In-Stock

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$0.042

6,000

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$0.042

Rochester

USA . 1,300 parts In-Stock

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$0.075

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$0.062

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$0.055

1,300

-

$0.075

$0.062

$0.055

Farnell

UK . 779 parts In-Stock

1+ parts

-

100+ parts

$0.067

1k+ parts

$0.060

10k+ parts

$0.056

779

-

$0.067

$0.060

$0.056

Element14

Singapore . 779 parts In-Stock

1+ parts

-

100+ parts

$0.108

1k+ parts

$0.091

10k+ parts

$0.082

779

-

$0.108

$0.091

$0.082

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 948 parts In-Stock

1+ parts

$0.058

100+ parts

-

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948

$0.058

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.105

100+ parts

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450

$0.105

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Vyrian

USA . 4,889 parts In-Stock

1+ parts

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4,889

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VNN

France . 3,363 parts In-Stock

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3,363

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NAC Semi

USA . 3,000 parts In-Stock

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$0.340

3,000

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$0.340

Distributors (Availability)

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Corohmni

South Africa . 908 parts In-Stock

1+ parts

$0.027

100+ parts

-

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908

$0.027

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Ampacity Inc.

Singapore . 4,990 parts In-Stock

1+ parts

$0.052

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4,990

$0.052

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Corphita

USA . 759 parts In-Stock

1+ parts

$0.055

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759

$0.055

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Argo Parts USA

USA . 907 parts In-Stock

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$0.105

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$0.101

907

$0.105

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$0.101

Aztec Data Supply Inc.

USA . 3,553 parts In-Stock

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$0.134

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3,553

$0.134

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Modulus Dynamics

Lithuania . 17,139 parts In-Stock

1+ parts

$0.159

100+ parts

$0.153

1k+ parts

$0.146

10k+ parts

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17,139

$0.159

$0.153

$0.146

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Continental Prestige Electronics

USA . 1,069 parts In-Stock

1+ parts

$0.314

100+ parts

$0.118

1k+ parts

$0.068

10k+ parts

$0.046

1,069

$0.314

$0.118

$0.068

$0.046

Epart123

USA . 150,000 parts In-Stock

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Perfect Parts

USA . 23,632 parts In-Stock

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Lixinc

USA . 16,496 parts In-Stock

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Authorized Procurement Solutions

USA . 14,000 parts In-Stock

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GreenTree Electronics

Israel . 2,708 parts In-Stock

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2,708

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RC Electronics

USA . 498 parts In-Stock

1+ parts

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$0.120

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$0.120

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$0.110

498

-

$0.120

$0.120

$0.110

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.102

1k+ parts

$0.099

10k+ parts

$0.097

100

-

$0.102

$0.099

$0.097

Overview

Unlock the power of cutting-edge technology with the BAR6305WH6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality PIN Diodes that cater to the demands of today's market. Perfect for switching applications in the S Band frequency range, this product boasts a common cathode configuration with two elements. With a maximum operating temperature of 150°C and a low diode capacitance of 0.3 pF, customers can trust in the reliability and efficiency of this small outline package. Experience seamless performance and unmatched value with the BAR6305WH6327XTSA1 - the ultimate solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, providing protection for the diodes inside the package.

Config: COMMON CATHODE, 2 ELEMENTS

Common cathode configuration simplifies circuit design and ensures consistent performance across both elements.

Frequency Band: S BAND

Designed for use in the S band frequency range, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the circuit board.

Maximum Diode Capacitance: 0.3 pF

Low diode capacitance ensures high-frequency performance and minimal signal loss.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and easy to handle during assembly.

No. of Terminals: 3

Having 3 terminals allows for flexibility in circuit connections and configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and is easy to handle.

Application: SWITCHING

Designed for use in switching applications, ensuring fast and efficient signal control.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in various environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for easy connections and ensures stable performance.

Maximum Diode Forward Resistance: 2 ohm

Low forward resistance minimizes power loss and ensures efficient signal transmission.

Maximum Power Dissipation: 0.25 W

With a maximum power dissipation of 0.25 W, this product can handle high power levels without overheating.

Nominal Minority Carrier Lifetime: 0.075 us

Short minority carrier lifetime ensures fast response times and efficient signal switching.

Minimum Breakdown Voltage: 50 V

High breakdown voltage provides protection against voltage spikes and ensures long-term reliability.

Diode Type: PIN DIODE

PIN diodes are known for their high-speed switching capabilities and low distortion, making them ideal for various applications.

Technology: POSITIVE-INTRINSIC-NEGATIVE

This technology allows for precise control of the diode's behavior, ensuring consistent performance.

Terminal Form: GULL WING

Gull wing terminal form is suitable for surface mount applications, providing secure connections and easy installation.

No. of Elements: 2

Having 2 elements allows for versatility in circuit design and applications.

Diode Element Material: SILICON

Silicon diode element material offers reliable performance and stability over a wide range of temperatures.

Technical Specifications

PIN Diodes BAR6305WH6327XTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

50 V

Config:

COMMON CATHODE, 2 ELEMENTS

Maximum Diode Capacitance:

.3 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2 ohm

Diode Type:

Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

.075 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAR6305WH6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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