Loading...

BAR66E6327HTSA1

Infineon Technologies

BAR66E6327HTSA1 by Infineon Technologies

Infineon's BAR66E6327HTSA1 is a PIN diode with 0.6 pF capacitance, 150V breakdown voltage, and 0.25W power dissipation. Ideal for RF switches in small outline packages, it features positive-intrinsic-negative technology and dual terminal position for high-frequency applications.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Distrelec

Netherlands . 3,000 parts In-Stock

1+ parts

$0.372

100+ parts

$0.339

1k+ parts

$0.273

10k+ parts

-

3,000

$0.372

$0.339

$0.273

-

Element14

Singapore . 8,870 parts In-Stock

1+ parts

-

100+ parts

$0.143

1k+ parts

$0.126

10k+ parts

$0.116

8,870

-

$0.143

$0.126

$0.116

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.067

6,000

-

-

-

$0.067

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.094

1k+ parts

$0.078

10k+ parts

$0.070

6,000

-

$0.094

$0.078

$0.070

Farnell

UK . 4,165 parts In-Stock

1+ parts

-

100+ parts

$0.147

1k+ parts

$0.086

10k+ parts

$0.074

4,165

-

$0.147

$0.086

$0.074

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Chip1Stop

Japan . 2,629 parts In-Stock

1+ parts

-

100+ parts

$0.094

1k+ parts

$0.070

10k+ parts

$0.068

2,629

-

$0.094

$0.070

$0.068

RS (Exports)

UK . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.096

10k+ parts

$0.079

1,775

-

-

$0.096

$0.079

Verical

USA . 1,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.162

10k+ parts

-

1,479

-

-

$0.162

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 696 parts In-Stock

1+ parts

$0.073

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$0.073

-

-

-

Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$0.131

-

-

-

TME

Poland . 1,995 parts In-Stock

1+ parts

$0.240

100+ parts

$0.129

1k+ parts

-

10k+ parts

-

1,995

$0.240

$0.129

-

-

Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,500

-

-

-

-

Vyrian

USA . 16,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,401

-

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.095

3,000

-

-

-

$0.095

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.317

3,000

-

-

-

$0.317

VNN

France . 1,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,473

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 135 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$0.040

-

-

-

Ampacity Inc.

Singapore . 17,676 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

-

10k+ parts

-

17,676

$0.054

-

-

-

Corphita

USA . 79 parts In-Stock

1+ parts

$0.069

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$0.069

-

-

-

Semicontronic

India . 17,786 parts In-Stock

1+ parts

$0.117

100+ parts

$0.114

1k+ parts

$0.113

10k+ parts

-

17,786

$0.117

$0.114

$0.113

-

Modulus Dynamics

Lithuania . 32,432 parts In-Stock

1+ parts

$0.128

100+ parts

$0.123

1k+ parts

$0.118

10k+ parts

-

32,432

$0.128

$0.123

$0.118

-

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$0.128

100+ parts

-

1k+ parts

-

10k+ parts

-

241

$0.128

-

-

-

Argo Parts USA

USA . 4,702 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

-

10k+ parts

$0.127

4,702

$0.131

-

-

$0.127

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.131

-

-

-

Continental Prestige Electronics

USA . 16,250 parts In-Stock

1+ parts

$0.418

100+ parts

$0.146

1k+ parts

$0.091

10k+ parts

$0.064

16,250

$0.418

$0.146

$0.091

$0.064

Component Stockers USA

USA . 179,706 parts In-Stock

1+ parts

$0.430

100+ parts

$0.130

1k+ parts

$0.100

10k+ parts

$0.070

179,706

$0.430

$0.130

$0.100

$0.070

Perfect Parts

USA . 99,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99,080

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,260

-

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Overview

Enhance your electronic designs with the BAR66E6327HTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability. This PIN diode offers exceptional performance with its series connected, center tap configuration and low diode capacitance. Perfect for applications requiring fast switching and RF signal control, this diode provides customers with superior value and benefits. Trust Infineon to provide cutting-edge technology that meets your design needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, ensuring the reliability of the product.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Series connected configuration with center tap and 2 elements allows for precise control and efficient performance in circuit applications.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on circuit boards, saving time and effort.

Maximum Diode Capacitance: 0.6 pF

Low diode capacitance of 0.6 pF ensures fast response times and high-frequency operation, making it suitable for various high-speed applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and space-saving designs in electronic circuits.

No. of Terminals: 3

3 terminals provide versatility in circuit connections and configurations, increasing the application range of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style makes the product suitable for compact devices and applications with limited space availability.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connection options, optimizing the design for specific requirements.

Maximum Power Dissipation: 0.25 W

High maximum power dissipation of 0.25 W ensures reliable operation under various load conditions, enhancing the product's performance and longevity.

Nominal Minority Carrier Lifetime: 0.7 us

Nominal minority carrier lifetime of 0.7 us contributes to efficient signal control and switching capabilities, improving overall performance in signal processing applications.

Minimum Breakdown Voltage: 150 V

Minimum breakdown voltage of 150 V ensures robustness and protection against voltage surges, making the product suitable for high-voltage applications.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and assembly processes, ensuring the product's durability and stability in harsh operating environments.

Diode Type: PIN DIODE

PIN diode technology offers high performance in RF and microwave applications, providing low distortion and high linearity for signal processing.

Technology: POSITIVE-INTRINSIC-NEGATIVE

Positive-intrinsic-negative technology enhances the diode's performance and efficiency in signal control and modulation, making it a reliable choice for RF and microwave circuits.

Terminal Form: GULL WING

Gull wing terminal form allows for secure and stable solder connections, ensuring the product's reliability and longevity in demanding operating conditions.

No. of Elements: 2

2 elements offer precise signal control and modulation capabilities, making the product suitable for various RF and microwave circuit applications.

Diode Element Material: SILICON

Silicon diode element material provides high efficiency and reliability in signal processing, offering low noise and high sensitivity for improved performance.

Technical Specifications

PIN Diodes BAR66E6327HTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

150 V

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Maximum Diode Capacitance:

.6 pF

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

Nominal Minority Carrier Lifetime:

.7 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Form:

Terminal Position:

Trade Compliance

BAR66E6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20