Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1SV264-TL-E by Onsemi is a PIN diode with TIN BISMUTH finish. It can withstand 30s at 260°C peak reflow temperature. Utilized in RF switches and attenuators due to its POSITIVE-INTRINSIC-NEGATIVE technology.
Median Price
$0.187
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13
In-Stock Inventory
1k+
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1+ parts
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Chip1Stop
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TIN BISMUTH terminal finish helps in providing good solderability and long-term reliability, making the product suitable for various applications.
The ability to withstand peak reflow temperatures for up to 30 seconds ensures that the product can be used in reflow soldering processes without damage, making it suitable for automated manufacturing.
With a peak reflow temperature of 260°C, this product can endure high-temperature soldering processes, offering reliability in harsh operating conditions.
The use of PIN diode technology provides this product with high-power handling capability and low distortion, making it ideal for RF switching and attenuator applications.
The POSITIVE-INTRINSIC-NEGATIVE technology in this product allows for faster response times and lower capacitance, enhancing its performance in high-frequency signal applications.
Silicon diode element material offers good thermal stability and high reliability, ensuring consistent performance over a wide temperature range, making it a dependable choice for various electronic circuits.
PIN Diodes 1SV264-TL-E attributes and parameters. Explore more PIN Diodes devices from Onsemi
Diode Element Material:
Diode Type:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Technology:
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
1SV264-TL-E Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
CRCW04020000Z0ED
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Onsemi
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
General Transistor
1SV121RY
Renesas Electronics
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SKY16602-632LF
Skyworks Solutions
PIN DIODE;
SMP1304-079LF
SMP1304-079LF by Skyworks Solutions is a PIN diode with 0.3 pF capacitance, 2 ohm forward resistance, and 0.25 W power dissipation. Ideal for high frequency to L band applications like attenuators due to its positive-intrinsic-negative technology and silicon diode element material.
HSMP-3822-BLK
Broadcom
HSMP-3822-BLK by Broadcom is a PIN diode with 20V reverse test voltage, 1.5 ohm max forward resistance, and 0.6 pF capacitance. Ideal for RF switches in small outline packages due to its positive-intrinsic-negative technology and 100 MHz resistive test frequency.
BAR64-05
Infineon Technologies
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
JDP2S02AFS
Toshiba
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FMMP3011TA
BAR66E6327HTSA1
Infineon's BAR66E6327HTSA1 is a PIN diode with 0.6 pF capacitance, 150V breakdown voltage, and 0.25W power dissipation. Ideal for RF switches in small outline packages, it features positive-intrinsic-negative technology and dual terminal position for high-frequency applications.
BAP63-02
NXP Semiconductors
MPN1000-12
Aeroflex Colorado Springs
APD1510-000
Alpha Industries
PIN DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BAR90-02LS
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR64-05W-E6433
PIN DIODE; Surface Mount: YES; Config: COMMON CATHODE, 2 ELEMENTS; Peak Reflow Temperature (C): 260; Maximum Diode Forward Resistance: 20 ohm; Maximum Operating Temperature: 125 Cel;
BAP64-06W,115
BXY42BA-3
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .24 pF; Minimum Breakdown Voltage: 50 V; Nominal Minority Carrier Lifetime: .04 us; Maximum Operating Temperature: 175 Cel;
MA4P4301F-1091T
M/a-com Technology Solutions
PIN DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FMMP3052TA
BAR64-05E6327
BAR64-05E6327 by Infineon Technologies is a PIN diode with common cathode, 2 elements, and 0.35 pF max capacitance. It operates in the S band frequency range and is suitable for applications like attenuators and switching due to its 20 ohm forward resistance and 150°C max temperature.
SP000742896
BAR6304WH6327XTSA1
Infineon's BAR6304WH6327XTSA1 is a PIN diode with 2 elements, 0.3 pF capacitance, and 2 ohm forward resistance. It operates in S band for switching applications at up to 150°C. The diode features a positive-intrinsic-negative technology, Gull Wing terminals, and a breakdown voltage of 50V.
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1SV233-TB-E
Sanyo Semiconductor
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Diode Element Material: SILICON; Terminal Finish: TIN BISMUTH;
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e6; Diode Element Material: SILICON; Peak Reflow Temperature (C): 260;
1SV234
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm;
1SV246
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm; Minimum Breakdown Voltage: 50 V;
1SV246-TL-E
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; JESD-609 Code: e6;
1SV251
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 4.5 ohm; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF;
1SV263
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 2.5 ohm;
1SV233
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV247
1SV248
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm; Nominal Diode Capacitance: .23 pF;
1SV250
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm;
1SV263-TL-E
PIN DIODE; Diode Element Material: SILICON; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
1SV251-TB-E
PIN DIODE; Terminal Finish: TIN BISMUTH; Moisture Sensitivity Level (MSL): 1; Diode Element Material: SILICON; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
1SV264
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 2.5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV267
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 2.5 ohm; Minimum Breakdown Voltage: 50 V;
1SV266
1SV234-TB-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); JESD-609 Code: e6;
1SV249
1SV249-TL-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
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