Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1SV264-TL-E by Onsemi is a PIN diode with TIN BISMUTH finish. It can withstand 30s at 260°C peak reflow temperature. Utilized in RF switches and attenuators due to its POSITIVE-INTRINSIC-NEGATIVE technology.
Median Price
$0.187
Lifecycle Status
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13
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TIN BISMUTH terminal finish helps in providing good solderability and long-term reliability, making the product suitable for various applications.
The ability to withstand peak reflow temperatures for up to 30 seconds ensures that the product can be used in reflow soldering processes without damage, making it suitable for automated manufacturing.
With a peak reflow temperature of 260°C, this product can endure high-temperature soldering processes, offering reliability in harsh operating conditions.
The use of PIN diode technology provides this product with high-power handling capability and low distortion, making it ideal for RF switching and attenuator applications.
The POSITIVE-INTRINSIC-NEGATIVE technology in this product allows for faster response times and lower capacitance, enhancing its performance in high-frequency signal applications.
Silicon diode element material offers good thermal stability and high reliability, ensuring consistent performance over a wide temperature range, making it a dependable choice for various electronic circuits.
PIN Diodes 1SV264-TL-E attributes and parameters. Explore more PIN Diodes devices from Onsemi
Diode Element Material:
Diode Type:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Technology:
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
1SV264-TL-E Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Panjit International
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
Fairchild Semiconductor
Meritek Electronics
EU2B-YS3103F
Idec
ROTARY SWITCH;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAR6702VH6327XTSA1
Infineon Technologies
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR65-03WE6327
BAR65-03WE6327 by Infineon Technologies is a PIN diode with 0.9 pF capacitance, 0.95 ohm forward resistance, and 30 V breakdown voltage. It is used for switching applications due to its positive-intrinsic-negative technology and small outline package style. Operating at up to 125°C, it features a matte tin terminal finish and gull wing terminal form.
1SV263-TL-E
1SV263-TL-E by Onsemi is a PIN diode with TIN BISMUTH finish. It has a max reflow time of 30s at 260 °C peak temperature. Utilizes POSITIVE-INTRINSIC-NEGATIVE tech in applications like RF switches and attenuators.
BAP50-02T/R
NXP Semiconductors
BAP65-01
BAR67-02V-E6433
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: .7 us; Minimum Breakdown Voltage: 150 V; Maximum Operating Temperature: 125 Cel; Nominal Diode Capacitance: .35 pF;
BAP70Q
BAP70Q by NXP Semiconductors is a complex PIN diode designed for S-band applications, featuring a max diode capacitance of 3 pF and forward resistance of 1.9 ohm. It comes in a small outline package with 5 terminals. Ideal for use as an attenuator, it ensures efficient signal management.
BAP64-04WT/R
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR81WH6327XTSA1
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;
JDP2S05SC(TPL3)
Toshiba
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 1 mA; Reverse Test Voltage: 1 V; Maximum Operating Temperature: 150 Cel; Maximum Diode Forward Resistance: 2.2 ohm;
1SV308TH3,FT
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 100 MHz; Diode Resistive Test Current: 10 mA; Reverse Test Voltage: 1 V; Maximum Diode Forward Resistance: 1.5 ohm;
BAR63-05E6433
SQM1150
Cobham Plc
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: 1 us; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Current: 50 mA;
5082-3081
Asi Semiconductor
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
JDP2S02S
BAR161E6327HTSA1
HSMP386C
Agilent Technologies
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 100 MHz; Maximum Diode Forward Resistance: 3 ohm; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb);
1SV308
JDP3C02AU,LF
PIN DIODE;
BAP65-02T/R
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1SV233-TB-E
Sanyo Semiconductor
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Diode Element Material: SILICON; Terminal Finish: TIN BISMUTH;
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e6; Diode Element Material: SILICON; Peak Reflow Temperature (C): 260;
1SV234
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm;
1SV246
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm; Minimum Breakdown Voltage: 50 V;
1SV246-TL-E
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; JESD-609 Code: e6;
1SV251
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 4.5 ohm; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF;
1SV263
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 2.5 ohm;
1SV233
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV247
1SV248
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm; Nominal Diode Capacitance: .23 pF;
1SV250
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm;
PIN DIODE; Diode Element Material: SILICON; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
1SV251-TB-E
PIN DIODE; Terminal Finish: TIN BISMUTH; Moisture Sensitivity Level (MSL): 1; Diode Element Material: SILICON; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
1SV264
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 2.5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV267
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 2.5 ohm; Minimum Breakdown Voltage: 50 V;
1SV266
1SV234-TB-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); JESD-609 Code: e6;
1SV249
1SV249-TL-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
Supply Digital Components
$106.00
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$11.90
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Quantity
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Total price ≈ $80,197.29
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