Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1SV251-TB-E by Onsemi is a PIN diode with TIN BISMUTH finish. It can withstand 30s at 260 °C peak reflow temperature. Utilized in applications requiring POSITIVE-INTRINSIC-NEGATIVE technology for RF switching and attenuating signals.
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TIN BISMUTH terminal finish provides excellent solderability and high thermal conductivity, ensuring a reliable connection in various electronic applications.
With a maximum time of 30 seconds at peak reflow temperature, this PIN Diode is suitable for quick and efficient soldering processes, saving time during production.
The peak reflow temperature of 260 °C allows for reliable soldering without damaging the diode, ensuring its performance and longevity in high-temperature environments.
The PIN Diode type offers high power handling capacity, low distortion, and fast switching speeds, making it ideal for RF switching and attenuator applications.
The POSITIVE-INTRINSIC-NEGATIVE technology of this PIN Diode provides low capacitance and high dynamic range, enabling efficient RF signal control and modulation in communications systems.
SILICON diode element material offers high reliability, low noise, and stable performance over a wide temperature range, making it a preferred choice for high-frequency and high-power applications.
PIN Diodes 1SV251-TB-E attributes and parameters. Explore more PIN Diodes devices from Onsemi
Diode Element Material:
Diode Type:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Technology:
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
1SV251-TB-E Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ESD5Z5.0T1G
Onsemi
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LD1117S33CTR
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EU2B-YS3103F
Idec
ROTARY SWITCH;
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
CLA4609-086LF
Skyworks Solutions
CLA4609-086LF by Skyworks Solutions is a PIN diode with a max forward resistance of 1.5 ohm and reverse test voltage of 30V, suitable for limiter applications in the C band frequency range. It operates b/w -55 to 150°C, has a diode capacitance of 0.6 pF, and features a small outline package style for surface mount assembly.
FMMP3051TC
Diodes Incorporated
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CLA4605-000
Alpha Industries
PIN DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BA683
Infineon Technologies
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 100 MHz; Maximum Operating Temperature: 150 Cel; Nominal Diode Capacitance: 1.5 pF; Diode Resistive Test Current: 3 mA;
CLA4605-000 by Skyworks Solutions is a single PIN diode for KA band applications. With a max diode capacitance of 0.15 pF, it operates b/w -65°C to 175°C. Ideal for limiters, it has a forward resistance of 2 ohm and breakdown voltage of 30V.
BAP51-03,115
NXP Semiconductors
The NXP Semiconductors BAP51-03,115 is a PIN diode with a max forward resistance of 2.5 ohm and capacitance of 0.55 pF. It operates b/w -65 to 150 °C and has a breakdown voltage of 60 V. Ideal for RF switches, attenuators, and phase shifters in communication systems due to its high-speed switching capabilities.
BAR6403WE6327HTSA1
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
5082-3081
Agilent Technologies
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MA4P604-131
Tyco Electronics M/a-com
BAR151E6327HTSA1
Infineon's BAR151E6327HTSA1 is a PIN diode with common cathode, 2 elements, and high frequency band. It has a max diode capacitance of 0.5 pF and is suitable for attenuator and switching applications. The diode operates at up to 150°C, with a forward resistance of 12 ohm and power dissipation of 0.25 W.
BAR6302LE6327XTMA1
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAP50-04W,115
The NXP Semiconductors BAP50-04W,115 is a PIN diode with 2 elements in series connected configuration. It has a max diode capacitance of 0.6 pF and operates b/w -65°C to 150°C. Ideal for applications requiring high-speed switching and RF signal routing in small outline packages.
BAT18-05
BAP64-05TRL13
HSMP-3822-BLK
Hewlett Packard
MPN3404RL1
MPN3404RL1 by Onsemi is a PIN diode with a max power dissipation of 0.4W and very high frequency band for switching applications. It has a diode capacitance of 2pF, forward resistance of 0.85 ohm, and breakdown voltage of 20V, making it suitable for high-frequency switching circuits. The diode element material is silicon with a positive-intrinsic-negative technology in a cylindrical package style.
JDP2S02T
Toshiba
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BXY44-TS
PIN DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
5082-3080
SP000010186
PIN DIODE;
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1SV233-TB-E
Sanyo Semiconductor
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Diode Element Material: SILICON; Terminal Finish: TIN BISMUTH;
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e6; Diode Element Material: SILICON; Peak Reflow Temperature (C): 260;
1SV234
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm;
1SV246
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm; Minimum Breakdown Voltage: 50 V;
1SV246-TL-E
PIN DIODE; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; JESD-609 Code: e6;
1SV251
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 4.5 ohm; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .23 pF;
1SV263
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 2.5 ohm;
1SV264-TL-E
1SV264-TL-E by Onsemi is a PIN diode with TIN BISMUTH finish. It can withstand 30s at 260°C peak reflow temperature. Utilized in RF switches and attenuators due to its POSITIVE-INTRINSIC-NEGATIVE technology.
1SV233
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV247
1SV248
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm; Nominal Diode Capacitance: .23 pF;
1SV250
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 4.5 ohm;
1SV263-TL-E
PIN DIODE; Diode Element Material: SILICON; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
1SV264
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 2.5 ohm; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V;
1SV267
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 2.5 ohm; Minimum Breakdown Voltage: 50 V;
1SV266
1SV234-TB-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Tin/Bismuth (Sn/Bi); JESD-609 Code: e6;
1SV249
1SV249-TL-E
PIN DIODE; Technology: POSITIVE-INTRINSIC-NEGATIVE; JESD-609 Code: e6; Terminal Finish: TIN BISMUTH; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
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