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BAR64-02V-H6327

Infineon Technologies

BAR64-02V-H6327 by Infineon Technologies

Infineon's BAR64-02V-H6327 is a PIN diode with 150V breakdown voltage, 20 ohm forward resistance, and 0.17 pF capacitance. Ideal for RF switches, attenuators, and phase shifters in applications requiring high-speed switching and low insertion loss.

Median Price

$0.294

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 116 parts In-Stock

1+ parts

$0.350

100+ parts

$0.146

1k+ parts

$0.078

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$0.055

116

$0.350

$0.146

$0.078

$0.055

Verical

USA . 330 parts In-Stock

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$0.238

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330

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$0.238

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Digiode

USA . 821 parts In-Stock

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$0.200

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Vyrian

USA . 85,540 parts In-Stock

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VNN

France . 28,985 parts In-Stock

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Velocity Electronics

USA . 9,000 parts In-Stock

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EPE Components Inc.

USA . 1,879 parts In-Stock

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Bristol Electronics

USA . 1,879 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,015 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 450 parts In-Stock

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Cyclops Electronics Ltd

UK . 174 parts In-Stock

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Distributors (Availability)

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CoreStaff

Japan . 330 parts In-Stock

1+ parts

$0.041

100+ parts

$0.038

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$0.038

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330

$0.041

$0.038

$0.038

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Ampacity Inc.

Singapore . 85,562 parts In-Stock

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$0.051

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Semicontronic

India . 85,417 parts In-Stock

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$0.051

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$0.050

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$0.049

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Corohmni

South Africa . 577 parts In-Stock

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$0.082

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Modulus Dynamics

Lithuania . 5,678 parts In-Stock

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$0.170

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$0.163

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$0.156

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Corphita

USA . 721 parts In-Stock

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$0.189

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Andel Nordic

Denmark . 4,439 parts In-Stock

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$23.320

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$16.322

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$16.322

4,439

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Perfect Parts

USA . 61,134,491 parts In-Stock

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Spain . 45,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 18,484 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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Lixinc

USA . 5,555 parts In-Stock

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Argo Parts USA

USA . 4,119 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 806 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BAR64-02V-H6327 PIN Diodes from Infineon Technologies. Known for their superior quality and reliability, Infineon Technologies has crafted a product that exceeds expectations in various applications. Whether you're looking to enhance signal switching or improve RF performance, this surface-mount diode offers unparalleled value and benefits. With a maximum operating temperature of 125°C and a minimum breakdown voltage of 150V, this PIN diode is the perfect solution for your electronic needs. Experience the advantages of precision engineering and innovation with the BAR64-02V-H6327 by Infineon Technologies.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy and fast installation, making this product suitable for compact and dense electronic circuits.

Reverse Test Voltage: 0 V

The low reverse test voltage ensures efficient performance and protection against reverse voltage situations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product is suitable for various industrial applications where elevated temperatures may be present.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and reliability, ensuring a secure connection in electronic assemblies.

Maximum Diode Forward Resistance: 20 ohm

The low maximum diode forward resistance helps in reducing power losses and improving overall efficiency in the circuit.

Nominal Diode Capacitance: 0.17 pF

The low nominal diode capacitance ensures high-frequency operation and minimal signal distortion in RF applications.

Nominal Minority Carrier Lifetime: 1.55 us

The nominal minority carrier lifetime contributes to the fast switching speed and high-frequency operation of the diode.

Minimum Breakdown Voltage: 150 V

The high minimum breakdown voltage provides protection against voltage spikes and ensures the reliability of the diode in harsh operating conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient soldering processes without damaging the diode.

Diode Resistive Test Frequency: 100 MHz

The high diode resistive test frequency of 100 MHz indicates the capability of the diode to handle high-frequency signals with low losses.

Diode Resistive Test Current: 1 mA

The low diode resistive test current ensures accurate and consistent testing results while minimizing power consumption.

Diode Type: PIN DIODE

Being a PIN diode, this product offers low distortion, high linearity, and fast response times, making it suitable for RF switches, attenuators, and phase shifters.

Technical Specifications

PIN Diodes BAR64-02V-H6327 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

150 V

Nominal Diode Capacitance:

.17 pF

Maximum Diode Forward Resistance:

20 ohm

Diode Resistive Test Current:

1 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

1.55 us

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

125 Cel

Peak Reflow Temperature (C):

260

Reverse Test Voltage:

0 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

BAR64-02V-H6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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