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BAR6405E6327HTSA1

Infineon Technologies

BAR6405E6327HTSA1 by Infineon Technologies

Infineon Technologies' BAR6405E6327HTSA1 is a PIN diode with common cathode configuration and 2 elements. It operates in the C band frequency range and has a max diode capacitance of 0.35 pF. This diode is commonly used as an attenuator or for switching applications.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 40 parts In-Stock

1+ parts

$0.088

100+ parts

$0.083

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$0.083

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40

$0.088

$0.083

$0.083

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DigiKey

USA . 298 parts In-Stock

1+ parts

$0.180

100+ parts

$0.089

1k+ parts

$0.073

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$0.065

298

$0.180

$0.089

$0.073

$0.065

Verical

USA . 180,000 parts In-Stock

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$0.092

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$0.092

Arrow

USA . 15,000 parts In-Stock

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$0.063

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$0.063

Farnell

UK . 3,000 parts In-Stock

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-

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$0.118

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$0.073

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$0.054

3,000

-

$0.118

$0.073

$0.054

Chip1Stop

Japan . 1,104 parts In-Stock

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-

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$0.044

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$0.044

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1,104

-

$0.044

$0.044

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Distributors (In-Stock)

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Digiode

USA . 897 parts In-Stock

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$0.041

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897

$0.041

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Nova Conductors

Japan . 500 parts In-Stock

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$0.110

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500

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Vyrian

USA . 3,215 parts In-Stock

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3,215

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Semi Source

USA . 2,843 parts In-Stock

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Euro-Tech

UK . 1,943 parts In-Stock

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NAC Semi

USA . 224 parts In-Stock

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VNN

France . 46 parts In-Stock

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Semicontronic

India . 7,707 parts In-Stock

1+ parts

$0.037

100+ parts

$0.036

1k+ parts

$0.036

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7,707

$0.037

$0.036

$0.036

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Ampacity Inc.

Singapore . 3,046 parts In-Stock

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$0.037

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3,046

$0.037

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Corphita

USA . 421 parts In-Stock

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$0.039

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421

$0.039

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Aztec Data Supply Inc.

USA . 4,865 parts In-Stock

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$0.058

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$0.058

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Modulus Dynamics

Lithuania . 3,763 parts In-Stock

1+ parts

$0.085

100+ parts

$0.082

1k+ parts

$0.078

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3,763

$0.085

$0.082

$0.078

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Corohmni

South Africa . 156 parts In-Stock

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$0.085

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156

$0.085

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.088

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$0.083

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$0.083

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40

$0.088

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$0.083

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Aranea Global

USA . 100 parts In-Stock

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$0.108

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$0.104

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100

$0.108

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$0.104

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Argo Parts USA

USA . 3,026 parts In-Stock

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$0.110

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$0.107

3,026

$0.110

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$0.107

Continental Prestige Electronics

USA . 2,352 parts In-Stock

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$0.225

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$0.071

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$0.062

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$0.225

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Epart123

USA . 150,000 parts In-Stock

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Perfect Parts

USA . 30,822 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,471 parts In-Stock

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Glotronic Ltd.

UK . 16,800 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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$0.090

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3,000

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GreenTree Electronics

Israel . 991 parts In-Stock

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Overview

Discover the BAR6405E6327HTSA1 by Infineon Technologies, a high-quality PIN diode that offers exceptional performance and reliability. Manufactured by Infineon Technologies, a trusted name in the industry, this product is known for its durability and precision. With applications in attenuators and switching, it provides versatile solutions for various electronic systems. Featuring a common cathode configuration and two elements, it delivers optimal functionality. Its small outline package shape and surface mount capability make it easy to integrate into any design. Experience the value of the BAR6405E6327HTSA1, with its low diode capacitance, high breakdown voltage, and excellent power dissipation. Trust in Infineon Technologies to provide you with cutting-edge technology that surpasses expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the package is durable and can withstand various environmental conditions, making it a reliable choice.

Frequency Band: C BAND

Operating in the C band frequency range makes this product suitable for a wide range of applications including communication systems and radar systems.

Maximum Diode Capacitance: 0.35 pF

Low diode capacitance means minimal signal loss and higher efficiency in high-frequency applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function effectively even in cold environments.

Terminal Finish: TIN

The terminal finish of tin provides good electrical conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

No. of Elements: 2

Having 2 elements allows for more versatile circuit designs and applications, providing flexibility in use.

Diode Element Material: SILICON

Silicon diode element material offers excellent performance characteristics such as high conductivity and reliability.

Technical Specifications

PIN Diodes BAR6405E6327HTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

ATTENUATOR; SWITCHING

Minimum Breakdown Voltage:

150 V

Config:

COMMON CATHODE, 2 ELEMENTS

Maximum Diode Capacitance:

.35 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1.35 ohm

Diode Type:

Frequency Band:

C BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

1.55 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Reference Standard:

AEC-Q101

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAR6405E6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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