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BAR6402ELE6327XTMA1

Infineon Technologies

BAR6402ELE6327XTMA1 by Infineon Technologies

PIN DIODE; Surface Mount: YES; Diode Element Material: SILICON; Diode Resistive Test Frequency: 100 MHz; Moisture Sensitivity Level (MSL): 1; Minimum Breakdown Voltage: 150 V;

Median Price

$0.081

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,062 parts In-Stock

1+ parts

$0.055

100+ parts

$0.052

1k+ parts

$0.047

10k+ parts

-

2,062

$0.055

$0.052

$0.047

-

Newark

USA . 13,450 parts In-Stock

1+ parts

$0.155

100+ parts

$0.076

1k+ parts

$0.063

10k+ parts

-

13,450

$0.155

$0.076

$0.063

-

DigiKey

USA . 98,435 parts In-Stock

1+ parts

$0.160

100+ parts

$0.078

1k+ parts

$0.064

10k+ parts

$0.061

98,435

$0.160

$0.078

$0.064

$0.061

Arrow

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

-

-

-

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Verical

USA . 15,000 parts In-Stock

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15,000

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Distrelec

Netherlands . 15,000 parts In-Stock

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15,000

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EBV Elektronik

Germany . 15,000 parts In-Stock

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15,000

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Farnell

UK . 10,399 parts In-Stock

1+ parts

-

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$0.044

10k+ parts

$0.040

10,399

-

-

$0.044

$0.040

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

-

100+ parts

$0.081

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30

-

$0.081

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 394 parts In-Stock

1+ parts

$0.049

100+ parts

-

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394

$0.049

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Digiode

USA . 969 parts In-Stock

1+ parts

$0.052

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969

$0.052

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North Shore Components

USA . 32,775 parts In-Stock

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32,775

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NAC Semi

USA . 15,000 parts In-Stock

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15,000

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TME

Poland . 15,000 parts In-Stock

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15,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 709 parts In-Stock

1+ parts

$0.050

100+ parts

-

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709

$0.050

-

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Modulus Dynamics

Lithuania . 18,844 parts In-Stock

1+ parts

$0.050

100+ parts

$0.048

1k+ parts

$0.046

10k+ parts

-

18,844

$0.050

$0.048

$0.046

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AZTECH Wire

Italy . 179 parts In-Stock

1+ parts

$20.820

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179

$20.820

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Eastek

USA . 150,000 parts In-Stock

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Epart123

USA . 120,000 parts In-Stock

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GreenTree Electronics

Israel . 3,700 parts In-Stock

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3,700

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,702 parts In-Stock

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1,702

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Native Components

USA . 44 parts In-Stock

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44

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Technical Specifications

PIN Diodes BAR6402ELE6327XTMA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

150 V

Nominal Diode Capacitance:

.13 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

20 ohm

Diode Resistive Test Current:

1 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

JESD-609 Code:

e4

Nominal Minority Carrier Lifetime:

1.55 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Reverse Test Voltage:

0 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

GOLD

Trade Compliance

BAR6402ELE6327XTMA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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