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MPL4701-206

Microchip Technology

MPL4701-206 by Microchip Technology

MPL4701-206 by Microchip Tech: PIN diode for limiter apps. Features 0.2 pF capacitance, 2.5 ohm forward resistance, and 15 V breakdown voltage. Operates from -55 to 150 °C in ultra-high frequency to X band range.

Median Price

$4.504

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 1,673 parts In-Stock

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$4.150

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$3.760

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$3.370

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Mouser Electronics

USA . 1,362 parts In-Stock

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$4.320

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Arrow

USA . 333 parts In-Stock

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$4.689

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333

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Verical

USA . 300 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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$4.161

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900

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Vyrian

USA . 839 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 684 parts In-Stock

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$3.530

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684

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Bastille Electronics

Australia . 2,408 parts In-Stock

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$4.161

100+ parts

$3.953

1k+ parts

$3.755

10k+ parts

$3.703

2,408

$4.161

$3.953

$3.755

$3.703

Argo Parts USA

USA . 1,155 parts In-Stock

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$4.161

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Continental Prestige Electronics

USA . 762 parts In-Stock

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$4.078

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Microchip USA

USA . 7,440 parts In-Stock

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Montano Global Distributors

Canada . 7,937 parts In-Stock

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NIA Electronics

USA . 6,988 parts In-Stock

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Ledger Components

France . 6,988 parts In-Stock

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Authorized Procurement Solutions

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LMD Electronica

Estonia . 4,399 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,635 parts In-Stock

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Overview

Looking to enhance your electronic design projects? Look no further than the MPL4701-206 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality PIN Diodes that are perfect for applications ranging from limiters to ultra high frequency to X band. With its advanced technology and impressive specifications, this product offers incredible value and benefits to customers, making it a must-have component for any project. Upgrade your designs today with the MPL4701-206 and experience the advantages that only Microchip Technology can provide.

Feature Benefit Bullets

Config: SINGLE

Having a single configuration simplifies the design and implementation process.

Frequency Band: ULTRA HIGH FREQUENCY TO X BAND

Wide frequency band coverage allows for versatile usage in various applications.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly.

Maximum Diode Capacitance: 0.2 pF

Low diode capacitance ensures high speed and efficiency in signal switching applications.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space on PCBs.

Reverse Test Voltage: 10 V

A high reverse test voltage offers durability and reliability in operations.

No. of Terminals: 2

Having 2 terminals simplifies connectivity and integration into circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and good heat dissipation.

Application: LIMITER

Designed for limiting applications, ensuring protection of sensitive components.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in extreme conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in cold environments.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection of the diode.

Maximum Diode Forward Resistance: 2.5 ohm

Low forward resistance ensures minimal signal loss and high efficiency.

Minimum Breakdown Voltage: 15 V

High minimum breakdown voltage offers protection against voltage spikes.

Diode Resistive Test Frequency: 1000 MHz

Tested at a high frequency to ensure performance in high-speed applications.

Diode Resistive Test Current: 10 mA

Tested at a high current to ensure reliability and consistency in operations.

Diode Type: PIN DIODE

Pin diode design offers fast response times and high power handling capabilities.

Technology: POSITIVE-INTRINSIC-NEGATIVE

This technology ensures low distortion and high linearity in signal processing.

Terminal Form: NO LEAD

No lead terminal form simplifies installation and reduces risk of damage.

Diode Element Material: SILICON

Silicon material ensures durability and stability in various operating conditions.

Technical Specifications

PIN Diodes MPL4701-206 attributes and parameters. Explore more PIN Diodes devices from Microchip Technology

Specs

Application:

LIMITER

Minimum Breakdown Voltage:

15 V

Config:

SINGLE

Maximum Diode Capacitance:

.2 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2.5 ohm

Diode Resistive Test Current:

10 mA

Diode Resistive Test Frequency:

1000 MHz

Diode Type:

Frequency Band:

ULTRA HIGH FREQUENCY TO X BAND

JESD-30 Code:

R-XBCC-N2

JESD-609 Code:

e4

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Reverse Test Voltage:

10 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

MPL4701-206 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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