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MPL4700-206/TR

Microchip Technology

MPL4700-206/TR by Microchip Technology

MPL4700-206/TR by Microchip is a single PIN diode for X band applications. With a max capacitance of 0.15 pF, forward resistance of 2 ohm, and breakdown voltage of 25V, it operates from -55 to 150°C. Ideal for RF switches and attenuators in communication systems.

Median Price

$4.730

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,000 parts In-Stock

1+ parts

$4.730

100+ parts

$4.260

1k+ parts

$3.840

10k+ parts

-

3,000

$4.730

$4.260

$3.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.240

100+ parts

-

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50

$5.240

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Vyrian

USA . 5,504 parts In-Stock

1+ parts

-

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5,504

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Distributors (Availability)

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Corohmni

South Africa . 196 parts In-Stock

1+ parts

$0.116

100+ parts

-

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196

$0.116

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Aztec Data Supply Inc.

USA . 213 parts In-Stock

1+ parts

$0.162

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213

$0.162

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Semicontronic

India . 628 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

1k+ parts

$0.980

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-

628

$1.010

$0.985

$0.980

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Continental Prestige Electronics

USA . 3,660 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

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10k+ parts

$5.135

3,660

$5.240

-

-

$5.135

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

$4.978

10k+ parts

$4.873

1,000

$5.240

-

$4.978

$4.873

AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$17.236

100+ parts

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303

$17.236

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Microchip USA

USA . 9,831 parts In-Stock

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9,831

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XL Components Corporation

Australia . 6,240 parts In-Stock

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6,240

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QUARKTWIN TECHNOLOGY LTD

USA . 5,729 parts In-Stock

1+ parts

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5,729

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QualityLine Systems

Poland . 4,797 parts In-Stock

1+ parts

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4,797

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Marpe Global Electronics

Taiwan . 2,483 parts In-Stock

1+ parts

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2,483

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Argo Parts USA

USA . 383 parts In-Stock

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383

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Overview

Looking for high-quality PIN diodes that deliver exceptional performance in X-band applications? Look no further than the MPL4700-206/TR by Microchip Technology. With its advanced technology and reliable design, this single-configured diode offers unmatched value and benefits to customers. Whether you need it for radar systems, RF switches, or attenuators, this diode's low diode capacitance, high breakdown voltage, and low forward resistance make it the perfect choice. Trust Microchip Technology for all your PIN diode needs and experience superior quality and performance like never before.

Feature Benefit Bullets

Config: SINGLE

Single configuration allows for easy integration into circuits without needing to consider multiple diode connections, simplifying the design process.

Frequency Band: X BAND

X Band frequency band support ensures compatibility with a wide range of high-frequency applications, making it versatile for various projects.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Diode Capacitance: 0.15 pF

Low diode capacitance of 0.15 pF allows for fast switching speeds and high-frequency operation, ideal for applications requiring quick response times.

Package Shape: RECTANGULAR

Rectangular package shape offers a compact form factor, saving space on the circuit board and facilitating tight layouts in electronic devices.

No. of Terminals: 2

Having 2 terminals simplifies the connection process, reducing the likelihood of wiring errors and ensuring a more straightforward integration into circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides robust protection for the diode, ensuring durability and reliability in various environmental conditions.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C allows for reliable performance in demanding thermal conditions, enhancing the diode's overall resilience.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures consistent functionality even in cold environments, making it suitable for diverse applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering onto the circuit board, ensuring secure connections and stable performance in the long run.

Maximum Diode Forward Resistance: 2 ohm

Low maximum diode forward resistance of 2 ohms minimizes signal loss and distortion, contributing to efficient signal transmission in the circuit.

Minimum Breakdown Voltage: 25 V

High minimum breakdown voltage of 25 V enhances the diode's ability to handle high voltage levels safely, improving overall reliability in demanding conditions.

Diode Resistive Test Current: 10 mA

Diode resistive test current of 10 mA enables accurate testing and evaluation of the diode's performance, ensuring quality control during production and assembly.

Diode Type: PIN DIODE

PIN diode technology offers high-speed switching and low distortion characteristics, making it suitable for applications requiring precise signal control and modulation.

Technology: POSITIVE-INTRINSIC-NEGATIVE

Positive-Intrinsic-Negative technology provides improved RF performance and lower distortion compared to other diode technologies, enhancing signal quality in communication systems.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly and reduces the risk of solder joint failure, ensuring a more reliable connection in the circuit.

Diode Element Material: SILICON

Silicon diode element material offers high reliability and temperature tolerance, making the diode suitable for a wide range of applications across different environments.

Technical Specifications

PIN Diodes MPL4700-206/TR attributes and parameters. Explore more PIN Diodes devices from Microchip Technology

Specs

Minimum Breakdown Voltage:

25 V

Config:

SINGLE

Maximum Diode Capacitance:

.15 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2 ohm

Diode Resistive Test Current:

10 mA

Diode Type:

Frequency Band:

X BAND

JESD-30 Code:

R-XBCC-N2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Form:

Terminal Position:

Trade Compliance

MPL4700-206/TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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