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BAR6406WH6327XTSA1

Infineon Technologies

BAR6406WH6327XTSA1 by Infineon Technologies

PIN DIODE; Moisture Sensitivity Level (MSL): 1; Technology: POSITIVE-INTRINSIC-NEGATIVE; Terminal Finish: TIN; JESD-609 Code: e3; Diode Element Material: SILICON;

Median Price

$0.196

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,822 parts In-Stock

1+ parts

$0.240

100+ parts

$0.122

1k+ parts

$0.101

10k+ parts

$0.092

7,822

$0.240

$0.122

$0.101

$0.092

Newark

USA . 8,645 parts In-Stock

1+ parts

$0.278

100+ parts

$0.159

1k+ parts

$0.139

10k+ parts

-

8,645

$0.278

$0.159

$0.139

-

Mouser Electronics

USA . 8,295 parts In-Stock

1+ parts

$0.380

100+ parts

$0.176

1k+ parts

$0.111

10k+ parts

$0.087

8,295

$0.380

$0.176

$0.111

$0.087

Rochester

USA . 525,000 parts In-Stock

1+ parts

-

100+ parts

$0.109

1k+ parts

$0.091

10k+ parts

$0.081

525,000

-

$0.109

$0.091

$0.081

Verical

USA . 486,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.101

486,000

-

-

-

$0.101

EBV Elektronik

Germany . 204,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

204,000

-

-

-

-

Chip1Stop

Japan . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.078

1k+ parts

-

10k+ parts

-

9,000

-

$0.078

-

-

Farnell

UK . 8,895 parts In-Stock

1+ parts

-

100+ parts

$0.152

1k+ parts

$0.087

10k+ parts

$0.081

8,895

-

$0.152

$0.087

$0.081

Element14

Singapore . 8,895 parts In-Stock

1+ parts

-

100+ parts

$0.279

1k+ parts

$0.174

10k+ parts

$0.171

8,895

-

$0.279

$0.174

$0.171

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 787 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$0.070

-

-

-

Digiode

USA . 747 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

-

10k+ parts

-

747

$0.085

-

-

-

TME

Poland . 204,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.105

204,000

-

-

-

$0.105

NAC Semi

USA . 162,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.470

162,000

-

-

-

$0.470

Ashlea Components Ltd

UK . 7,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 854 parts In-Stock

1+ parts

$0.080

100+ parts

-

1k+ parts

-

10k+ parts

-

854

$0.080

-

-

-

Modulus Dynamics

Lithuania . 2,989 parts In-Stock

1+ parts

$0.089

100+ parts

$0.085

1k+ parts

$0.082

10k+ parts

-

2,989

$0.089

$0.085

$0.082

-

Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

$0.534

100+ parts

$0.196

1k+ parts

$0.117

10k+ parts

$0.087

9,000

$0.534

$0.196

$0.117

$0.087

Eastek

USA . 252,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252,000

-

-

-

-

Perfect Parts

USA . 25,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,576

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Northwest PG Solutions

USA . 1,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,352

-

-

-

-

Native Components

USA . 410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

410

-

-

-

-

Technical Specifications

PIN Diodes BAR6406WH6327XTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Diode Element Material:

SILICON

Diode Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Trade Compliance

BAR6406WH6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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