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BAR63-02V-H6327

Infineon Technologies

BAR63-02V-H6327 by Infineon Technologies

Infineon's BAR63-02V-H6327 is a PIN diode with 0.3 pF capacitance, suitable for S band applications. It operates b/w -55°C to 125°C, with a breakdown voltage of 50V and forward resistance of 2 ohm. Ideal for switching purposes due to its positive-intrinsic-negative technology and matte tin terminal finish.

Median Price

$0.204

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15,816 parts In-Stock

1+ parts

$0.340

100+ parts

$0.141

1k+ parts

$0.075

10k+ parts

$0.053

15,816

$0.340

$0.141

$0.075

$0.053

Verical

USA . 15,000 parts In-Stock

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$0.067

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$0.067

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Digiode

USA . 468 parts In-Stock

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$0.314

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468

$0.314

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North Shore Components

USA . 140,588 parts In-Stock

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Vyrian

USA . 11,406 parts In-Stock

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VNN

France . 2,268 parts In-Stock

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Sensible Micro Corp

USA . 1,098 parts In-Stock

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ComSIT Distribution GmbH

Germany . 571 parts In-Stock

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ComSIT USA

USA . 571 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 318 parts In-Stock

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$0.047

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Ampacity Inc.

Singapore . 11,186 parts In-Stock

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$0.057

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Semicontronic

India . 11,143 parts In-Stock

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$0.057

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$0.056

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$0.055

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$0.057

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Modulus Dynamics

Lithuania . 31,676 parts In-Stock

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$0.187

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$0.180

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$0.172

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Corphita

USA . 512 parts In-Stock

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$0.297

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Andel Nordic

Denmark . 4,984 parts In-Stock

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$44.000

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$30.803

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$30.803

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$30.803

Perfect Parts

USA . 49,129 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 22,122 parts In-Stock

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Lixinc

USA . 19,948 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,766 parts In-Stock

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Argo Parts USA

USA . 670 parts In-Stock

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Overview

Unleash the power of innovation with the BAR63-02V-H6327 by Infineon Technologies. Crafted with precision and expertise, this PIN diode offers unparalleled quality and reliability for your switching applications. With a single configuration and small outline package, this diode is designed to deliver optimal performance in S Band frequency applications. Experience seamless functionality and enhanced efficiency with a diode forward resistance of just 2 ohms and a maximum power dissipation of 0.25 W. Trust in the superior technology of Infineon Technologies to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Frequency Band: S BAND

Operating in the S band frequency range makes this product suitable for various communication and radar systems operating in this frequency range.

Maximum Diode Capacitance: 0.3 pF

Low diode capacitance ensures efficient switching operation and faster response times in high-frequency applications.

Reverse Test Voltage: 5 V

With a high reverse test voltage of 5V, this product can handle reverse bias conditions effectively, making it reliable in various circuit configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to be used in high-temperature environments without compromising its performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures this product can operate in harsh cold environments without any issues.

Maximum Power Dissipation: 0.25 W

The high maximum power dissipation rating of 0.25W enables this product to handle high power levels, making it suitable for high-power applications.

Diode Type: PIN DIODE

Being a PIN diode, this product offers low forward resistance and low RF resistance, making it suitable for high-frequency and high-power applications such as RF switching.

Technical Specifications

PIN Diodes BAR63-02V-H6327 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

50 V

Config:

SINGLE

Maximum Diode Capacitance:

.3 pF

Nominal Diode Capacitance:

.25 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2 ohm

Diode Resistive Test Current:

5 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

.075 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.25 W

Reverse Test Voltage:

5 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAR63-02V-H6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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