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BAR6304E6327HTSA1

Infineon Technologies

BAR6304E6327HTSA1 by Infineon Technologies

Infineon's BAR6304E6327HTSA1 is a PIN diode with 2 elements, 0.3 pF capacitance, and 2 ohm forward resistance. It operates in S band frequencies for switching applications at up to 150°C. The diode features a positive-intrinsic-negative technology, Gull Wing terminals, and a breakdown voltage of 50V.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 69 parts In-Stock

1+ parts

$0.280

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$0.107

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-

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69

$0.280

$0.107

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DigiKey

USA . 20,539 parts In-Stock

1+ parts

$0.290

100+ parts

$0.149

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$0.125

10k+ parts

$0.112

20,539

$0.290

$0.149

$0.125

$0.112

Newark

USA . 4,415 parts In-Stock

1+ parts

$0.322

100+ parts

$0.188

1k+ parts

$0.164

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-

4,415

$0.322

$0.188

$0.164

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Mouser Electronics

USA . 8,830 parts In-Stock

1+ parts

$0.460

100+ parts

$0.228

1k+ parts

$0.143

10k+ parts

$0.114

8,830

$0.460

$0.228

$0.143

$0.114

Verical

USA . 18,000 parts In-Stock

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$0.274

18,000

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$0.274

Farnell

UK . 4,710 parts In-Stock

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$0.112

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$0.102

10k+ parts

$0.096

4,710

-

$0.112

$0.102

$0.096

Chip1Stop

Japan . 1,831 parts In-Stock

1+ parts

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$0.140

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$0.101

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1,831

-

$0.140

$0.101

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Rochester

USA . 800 parts In-Stock

1+ parts

-

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$0.133

1k+ parts

$0.110

10k+ parts

$0.098

800

-

$0.133

$0.110

$0.098

Element14

Singapore . 765 parts In-Stock

1+ parts

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100+ parts

$0.326

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$0.173

10k+ parts

$0.163

765

-

$0.326

$0.173

$0.163

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 67 parts In-Stock

1+ parts

$0.104

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67

$0.104

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Nova Conductors

Japan . 63 parts In-Stock

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$0.236

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63

$0.236

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Vyrian

USA . 15,535 parts In-Stock

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15,535

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Rutronik

Germany . 12,000 parts In-Stock

1+ parts

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$0.097

12,000

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$0.097

Semtec, LLC

USA . 8,500 parts In-Stock

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8,500

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Rotakorn

Sweden . 4,525 parts In-Stock

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4,525

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NAC Semi

USA . 3,000 parts In-Stock

1+ parts

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$0.564

3,000

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$0.564

VNN

France . 1,435 parts In-Stock

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1,435

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 17,806 parts In-Stock

1+ parts

$0.049

100+ parts

$0.047

1k+ parts

$0.045

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17,806

$0.049

$0.047

$0.045

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Semicontronic

India . 4,390 parts In-Stock

1+ parts

$0.084

100+ parts

$0.082

1k+ parts

$0.081

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4,390

$0.084

$0.082

$0.081

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Corphita

USA . 27 parts In-Stock

1+ parts

$0.098

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27

$0.098

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Aztec Data Supply Inc.

USA . 1,003 parts In-Stock

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$0.119

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1,003

$0.119

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Argo Parts USA

USA . 1,897 parts In-Stock

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$0.162

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$0.157

1,897

$0.162

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$0.157

Corohmni

South Africa . 820 parts In-Stock

1+ parts

$0.167

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820

$0.167

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Ampacity Inc.

Singapore . 4,207 parts In-Stock

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$0.202

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$0.202

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.236

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$0.224

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$0.219

1,000

$0.236

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$0.224

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Epart123

USA . 30,000 parts In-Stock

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$0.090

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$0.090

Perfect Parts

USA . 26,170 parts In-Stock

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Eastek

USA . 24,000 parts In-Stock

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$0.170

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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RC Electronics

USA . 2,700 parts In-Stock

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$0.170

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$0.160

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$0.160

2,700

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$0.170

$0.160

$0.160

Speed Components Ltd (Excess)

Israel . 2,354 parts In-Stock

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2,354

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Continental Prestige Electronics

USA . 1,325 parts In-Stock

1+ parts

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100+ parts

$0.191

1k+ parts

$0.119

10k+ parts

$0.098

1,325

-

$0.191

$0.119

$0.098

Overview

Unlock the power of cutting-edge technology with the BAR6304E6327HTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality PIN diodes that are perfect for a wide range of applications such as switching. With a maximum operating temperature of 150°C and a low diode capacitance of 0.3 pF, this product offers unmatched performance and reliability. Experience the benefits of Infineon's advanced technology and take your projects to the next level with the BAR6304E6327HTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for applications requiring a compact and robust design.

Frequency Band: S BAND

Operating in the S band frequency range, this product is suitable for various communication and radar systems where reliable performance is required.

Maximum Diode Capacitance: 0.3 pF

With a low diode capacitance of only 0.3 pF, this product ensures minimal signal loss and high-speed switching capabilities.

Application: SWITCHING

Designed for switching applications, this product offers fast response times and efficient signal control, making it an excellent choice for high-frequency electronic systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this product can withstand elevated temperatures without compromising its performance, ensuring reliability in harsh environments.

Technology: POSITIVE-INTRINSIC-NEGATIVE

Utilizing the positive-intrinsic-negative technology, this product provides low resistance and fast switching speed, making it suitable for high-frequency applications where superior performance is essential.

Technical Specifications

PIN Diodes BAR6304E6327HTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

50 V

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Maximum Diode Capacitance:

.3 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2 ohm

Diode Type:

Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

.075 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAR6304E6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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