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UM9401SM

Microchip Technology

UM9401SM by Microchip Technology

UM9401SM by Microchip Technology is a PIN diode with high frequency to ultra high frequency band. It has a max diode capacitance of 1.5 pF and forward resistance of 1 ohm, suitable for switching applications. This surface-mount diode in glass package is designed for isolated case connection with 2 terminals and can handle up to 1.5 W power dissipation.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$4.420

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550

$4.420

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Vyrian

USA . 1,542 parts In-Stock

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1,542

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 708 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

1k+ parts

$0.980

10k+ parts

-

708

$1.010

$0.985

$0.980

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Ampacity Inc.

Singapore . 996 parts In-Stock

1+ parts

$3.010

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996

$3.010

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.332

100+ parts

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$4.158

10k+ parts

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500

$4.332

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$4.158

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Argo Parts USA

USA . 1,903 parts In-Stock

1+ parts

$4.420

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1,903

$4.420

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Continental Prestige Electronics

USA . 1,530 parts In-Stock

1+ parts

$4.420

100+ parts

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$4.332

1,530

$4.420

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$4.332

AZTECH Wire

Italy . 232 parts In-Stock

1+ parts

$12.706

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232

$12.706

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QUARKTWIN TECHNOLOGY LTD

USA . 21,245 parts In-Stock

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21,245

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Microchip USA

USA . 3,894 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,168 parts In-Stock

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Discover the cutting-edge UM9401SM PIN Diode by Microchip Technology, a top-tier manufacturer known for quality and reliability. Ideal for high frequency to ultra-high frequency applications, this single diode offers exceptional performance with its low forward resistance and high power dissipation capability. Whether used for switching or other applications, this surface mount diode provides unparalleled value and benefits to customers. Upgrade your projects with the UM9401SM and experience the advantage of state-of-the-art technology at your fingertips.

Feature Benefit Bullets

Package Body Material: GLASS

Glass package provides durability and high temperature resistance, making it suitable for a variety of applications.

Frequency Band: HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

Wide frequency band coverage allows for versatile use in high-frequency applications.

Maximum Diode Capacitance: 1.5 pF

Low diode capacitance ensures fast switching speeds and minimal signal distortion.

Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such scenarios.

Maximum Diode Forward Resistance: 1 ohm

Low forward resistance results in minimal power loss and efficient signal transmission.

Maximum Power Dissipation: 1.5 W

High power dissipation capability allows for handling high-power signals without damage.

Nominal Minority Carrier Lifetime: 2 us

Short minority carrier lifetime enables fast operation and response times.

Minimum Breakdown Voltage: 50 V

High breakdown voltage ensures reliability and protection against voltage spikes.

Technical Specifications

PIN Diodes UM9401SM attributes and parameters. Explore more PIN Diodes devices from Microchip Technology

Specs

Additional Features:

LOW DISTORTION

Application:

SWITCHING

Minimum Breakdown Voltage:

50 V

Case Connection:

ISOLATED

Config:

SINGLE

Maximum Diode Capacitance:

1.5 pF

Nominal Diode Capacitance:

1.5 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1 ohm

Diode Resistive Test Current:

50 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Frequency Band:

HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

JESD-30 Code:

O-LELF-R2

JESD-609 Code:

e0

Nominal Minority Carrier Lifetime:

2 us

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Maximum Power Dissipation:

1.5 W

Qualification:

Not Qualified

Reverse Test Voltage:

0 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

END

Trade Compliance

UM9401SM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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