Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: 1 us; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Current: 50 mA;
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PIN Diodes SQM1150 attributes and parameters. Explore more PIN Diodes devices from Cobham Plc
Minimum Breakdown Voltage:
Nominal Diode Capacitance:
Maximum Diode Forward Resistance:
Diode Resistive Test Current:
Diode Resistive Test Frequency:
Diode Type:
Nominal Minority Carrier Lifetime:
Maximum Operating Temperature:
Reverse Test Voltage:
Sub-Category:
Surface Mount:
SQM1150 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
The Cobham Group comprises a number of dynamic businesses in diverse specialist areas, each of which are experts in their field. Together we are a leading global technology and services innovator, highly regarded and respected for providing solutions to the most complex problems in some of the most challenging environments and missions. From the depths of the ocean to deep space and everywhere in between, our customers mission is our mission and every mission matters. Engineers critical, cutting edge data solutions for the most challenging missions on land, sea, and in air and space; with customised solutions across the entire signal chain, including RF, microwave and high reliability microelectronics.
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Telefunken
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
BAP50-03,115
NXP Semiconductors
The NXP Semiconductors BAP50-03,115 is a PIN diode with a max forward resistance of 5 ohm and diode capacitance of 0.55 pF. It operates b/w -65 to 150 °C and has a breakdown voltage of 50 V. Ideal for RF switches, attenuators, and phase shifters in communication systems.
BAP64-03
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBV3700LT1G
Onsemi
MMBV3700LT1G by Onsemi is a PIN diode with 1pF capacitance, 20V reverse test voltage, and 1 ohm forward resistance. It is used for very high-frequency switching applications due to its positive-intrinsic-negative technology and small outline package style. Operating at up to 125°C, it offers efficient performance in various electronic systems.
BAP1321-04,215
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MPN3700RLRM
The Onsemi MPN3700RLRM is a single PIN diode with 1 pF capacitance, suitable for very high frequency applications. It has a max forward resistance of 1 ohm and can handle up to 0.28 W power dissipation. Ideal for switching operations at temperatures up to 125 °C, this diode features a breakdown voltage of 200 V and uses positive-intrinsic-negative technology.
BAP70AM,115
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 6; Surface Mount: YES; Package Shape: RECTANGULAR;
BXY42-T1(ES)
Infineon Technologies
PIN DIODE; Terminal Position: UNSPECIFIED; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ISS312
PIN DIODE; Terminal Form: THROUGH-HOLE; Surface Mount: NO; Package Shape: RECTANGULAR; Qualification: Not Qualified; Minimum Breakdown Voltage: 30 V;
BAR50-02L-E6433
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 1 V; Nominal Diode Capacitance: .5 pF; Maximum Diode Forward Resistance: 40 ohm; Diode Resistive Test Frequency: 100 MHz;
BAP51-05W,115
MA4P506-1072T
M/a-com Technology Solutions
MA4P506-1072T by M/a-com Technology Solutions is a PIN diode with 1 pF capacitance, 0.3 ohm forward resistance, and 500 V breakdown voltage. It is used for switching applications at up to 175°C, featuring a ceramic-metal-sealed co-fired package and positive-intrinsic-negative technology.
BAP70-05,215
934055903115
BAR63-04E6433
BAR63-03W
BAR67-04-E6327
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Nominal Minority Carrier Lifetime: .7 us; Reverse Test Voltage: 5 V; Minimum Breakdown Voltage: 150 V;
FMMP3051
Diodes Incorporated
JDP2S02ACT
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1SV121RY
Renesas Electronics
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
JDP3C02AU(TE85L)
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 10 mA; Maximum Diode Forward Resistance: 1.5 ohm; Minimum Breakdown Voltage: 30 V; Maximum Operating Temperature: 150 Cel;
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SQM1150
Temex Components
PIN DIODE; Terminal Position: DUAL; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1 pF; Maximum Diode Forward Resistance: .35 ohm; Reverse Test Voltage: 50 V; Diode Resistive Test Current: 50 mA;
SQM1050NT1
Cobham Plc
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Minimum Breakdown Voltage: 50 V; Reverse Test Voltage: 50 V; Nominal Minority Carrier Lifetime: 1 us;
SQM1150T1
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Nominal Minority Carrier Lifetime: 1 us; Maximum Operating Temperature: 150 Cel; Reverse Test Voltage: 50 V;
SQM1150T3
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1 pF;
SQM1150N
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Reverse Test Voltage: 50 V; Nominal Minority Carrier Lifetime: 1 us; Maximum Diode Forward Resistance: .35 ohm;
SQM1150NT1
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Nominal Minority Carrier Lifetime: 1 us; Diode Resistive Test Frequency: 120 MHz;
SQM1150NT3
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1 pF; Diode Resistive Test Frequency: 120 MHz; Maximum Diode Forward Resistance: .35 ohm;
SQM1250NT3
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Reverse Test Voltage: 50 V; Maximum Operating Temperature: 150 Cel; Maximum Diode Forward Resistance: .75 ohm;
SQM1450T1
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 50 V; Diode Resistive Test Frequency: 120 MHz; Diode Resistive Test Current: 50 mA; Maximum Diode Forward Resistance: .75 ohm;
SQM1350N
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1.1 pF; No. of Elements: 1; Maximum Diode Forward Resistance: .6 ohm; Minimum Breakdown Voltage: 50 V;
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 50 V; Diode Resistive Test Frequency: 120 MHz; Nominal Diode Capacitance: 1 pF; Maximum Operating Temperature: 150 Cel;
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; No. of Elements: 1; Diode Resistive Test Current: 50 mA; Minimum Breakdown Voltage: 200 V;
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 200 V; Nominal Diode Capacitance: 1 pF; No. of Elements: 1; Reverse Test Voltage: 50 V;
SQM1350
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1.1 pF; Maximum Operating Temperature: 150 Cel;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .6 pF; Maximum Diode Forward Resistance: .9 ohm; Minimum Breakdown Voltage: 50 V; Diode Resistive Test Frequency: 120 MHz;
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; Nominal Minority Carrier Lifetime: 1 us; Reverse Test Voltage: 50 V;
SQM1050T1
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: .9 ohm; No. of Elements: 1; Maximum Operating Temperature: 150 Cel; Diode Resistive Test Frequency: 120 MHz;
SQM1450
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; Nominal Minority Carrier Lifetime: 5 us; Minimum Breakdown Voltage: 50 V;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Frequency: 120 MHz; No. of Elements: 1;
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