Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SQM1150 by M/a-com Technology Solutions is a PIN diode with 50V reverse test voltage, 0.35 ohm max forward resistance, and 1pF capacitance. Ideal for RF applications due to its 120MHz resistive test frequency, it offers high breakdown voltage of 200V and operates up to 150°C.
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Being surface mountable makes this product easy to integrate into various electronic circuits and saves space compared to through-hole components.
The high reverse test voltage of 50V ensures robust performance and reliability in diverse applications.
With a maximum operating temperature of 150°C, this product can handle high temperature conditions without compromising performance.
The low forward resistance of 0.35 ohms results in minimal power loss and efficient signal transmission.
The low diode capacitance of 1 pF ensures fast switching speeds and high-frequency operation.
The short minority carrier lifetime of 1 microsecond allows for quick recovery and switching of the diode.
The high minimum breakdown voltage of 200V ensures protection against voltage spikes and overloads.
With a high resistive test frequency of 120 MHz, this diode is suitable for high-frequency applications and can handle rapid signal processing.
The diode can handle a resistive test current of 50 mA, making it ideal for various testing and operational scenarios.
The PIN diode type offers high performance, low noise, and fast response times, making it a reliable choice for RF and microwave applications.
PIN Diodes SQM1150 attributes and parameters. Explore more PIN Diodes devices from M/a-com Technology Solutions
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Nominal Diode Capacitance:
Maximum Diode Forward Resistance:
Diode Resistive Test Current:
Diode Resistive Test Frequency:
Diode Type:
Nominal Minority Carrier Lifetime:
No. of Elements:
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SQM1150 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. MACOM has achieved certification to the IATF16949 automotive standard, the ISO9001 international quality standard and the ISO14001 environmental management standard. MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operates facilities throughout the United States, Europe, and Asia.
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
General Semiconductor
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Fairchild Semiconductor
Rugao Dachang Electronic
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
BAP64-05,215
NXP Semiconductors
The NXP Semiconductors BAP64-05,215 is a PIN diode with common cathode configuration and 2 elements. It operates in the S band frequency range and has a max diode capacitance of 0.35 pF. Ideal for attenuator and switching applications, it can withstand temperatures from -65 to 150°C while offering a max power dissipation of 0.25 W.
HSMP-386L-TR1G
Broadcom
HSMP-386L-TR1G by Broadcom is a PIN diode with 3 separate elements, matte tin finish, and small outline package. It has a reverse test voltage of 50V and is used in attenuator and switching applications. With a max operating temperature of 150°C, it offers 0.2pF nominal diode capacitance and 0.5us minority carrier lifetime.
1SV246
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Maximum Diode Forward Resistance: 5 ohm; Minimum Breakdown Voltage: 50 V;
1SV237
Toshiba
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR6404E6327HTSA1
PIN DIODE; Terminal Finish: TIN; Technology: POSITIVE-INTRINSIC-NEGATIVE; Diode Element Material: SILICON; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3;
934061238315
PIN DIODE;
DSM8100-000
Skyworks Solutions
Skyworks Solutions' DSM8100-000 is a PIN diode with 0.025 pF capacitance, 3.5 ohm forward resistance, and 60 V breakdown voltage. Ideal for attenuator and switching applications, it features a ceramic-metal-sealed co-fired package in a microwave style for high power dissipation of 0.25 W.
FMMP3111TA
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ASML-5822
PIN DIODE; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
BAQ806/T3
PIN DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ASML-5822-BLKG
ASML-5822-BLKG by Broadcom is a PIN diode with 0.8 pF capacitance, 0.1 uA reverse current, and 0.6 ohm forward resistance. It is used as a limiter in applications requiring a breakdown voltage of 50 V, operating b/w -65 to 150 °C.
MA4P506-1072T
M/a-com Technology Solutions
MA4P506-1072T by M/a-com Technology Solutions is a PIN diode with 1 pF capacitance, 0.3 ohm forward resistance, and 500 V breakdown voltage. It is used for switching applications at up to 175°C, featuring a ceramic-metal-sealed co-fired package and positive-intrinsic-negative technology.
BA779
BAR17E6433
934056233115
ISS238
PIN DIODE; Terminal Form: THROUGH-HOLE; No. of Terminals: 2; Surface Mount: NO; Package Shape: RECTANGULAR; Config: SINGLE;
JDP2S12CR(TE85L)
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 10 mA; Maximum Operating Temperature: 175 Cel; Maximum Diode Forward Resistance: .7 ohm; Nominal Diode Capacitance: 1 pF;
MPN3700RLRM
The Onsemi MPN3700RLRM is a single PIN diode with 1 pF capacitance, suitable for very high frequency applications. It has a max forward resistance of 1 ohm and can handle up to 0.28 W power dissipation. Ideal for switching operations at temperatures up to 125 °C, this diode features a breakdown voltage of 200 V and uses positive-intrinsic-negative technology.
BAR50-02V-E6433
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: 1.1 us; Maximum Operating Temperature: 125 Cel; Minimum Breakdown Voltage: 50 V; Reverse Test Voltage: 1 V;
JDP2S12CR
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
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SQM1150
Cobham Plc
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: 1 us; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Current: 50 mA;
Temex Components
PIN DIODE; Terminal Position: DUAL; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SQM1050NT1
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Minimum Breakdown Voltage: 50 V; Reverse Test Voltage: 50 V; Nominal Minority Carrier Lifetime: 1 us;
SQM1150T1
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Nominal Minority Carrier Lifetime: 1 us; Maximum Operating Temperature: 150 Cel; Reverse Test Voltage: 50 V;
SQM1150T3
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1 pF;
SQM1150N
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Reverse Test Voltage: 50 V; Nominal Minority Carrier Lifetime: 1 us; Maximum Diode Forward Resistance: .35 ohm;
SQM1150NT1
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Nominal Minority Carrier Lifetime: 1 us; Diode Resistive Test Frequency: 120 MHz;
SQM1150NT3
PIN DIODE; Surface Mount: YES; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1 pF; Diode Resistive Test Frequency: 120 MHz; Maximum Diode Forward Resistance: .35 ohm;
SQM1250NT3
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: .75 ohm; Nominal Minority Carrier Lifetime: 2 us; Nominal Diode Capacitance: .9 pF; Reverse Test Voltage: 50 V;
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 50 V; Diode Resistive Test Frequency: 120 MHz; Nominal Diode Capacitance: 1 pF; Maximum Operating Temperature: 150 Cel;
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; No. of Elements: 1; Diode Resistive Test Current: 50 mA; Minimum Breakdown Voltage: 200 V;
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 200 V; Nominal Diode Capacitance: 1 pF; No. of Elements: 1; Reverse Test Voltage: 50 V;
SQM1050N
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: .6 pF; Diode Resistive Test Frequency: 120 MHz;
SQM1450NT1
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Diode Resistive Test Current: 50 mA; Maximum Diode Forward Resistance: .75 ohm; Nominal Diode Capacitance: 1.8 pF;
SQM1350
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Diode Resistive Test Current: 50 mA; Nominal Diode Capacitance: 1.1 pF; Maximum Operating Temperature: 150 Cel;
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; Nominal Minority Carrier Lifetime: 1 us; Reverse Test Voltage: 50 V;
SQM1450
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; Nominal Minority Carrier Lifetime: 5 us; Minimum Breakdown Voltage: 50 V;
SQM1250
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 120 MHz; Maximum Diode Forward Resistance: .75 ohm; Maximum Operating Temperature: 150 Cel; No. of Elements: 1;
SQM1450N
PIN DIODE; Surface Mount: YES; No. of Elements: 1; Diode Resistive Test Current: 50 mA; Diode Resistive Test Frequency: 120 MHz; Maximum Operating Temperature: 150 Cel;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: 1 pF; Minimum Breakdown Voltage: 200 V; Diode Resistive Test Frequency: 120 MHz; No. of Elements: 1;
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