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DMN33D8LDW-13

Diodes Incorporated

DMN33D8LDW-13 by Diodes Incorporated

DMN33D8LDW-13 by Diodes Inc. is a N-channel FET with 30V DS breakdown voltage and 0.25A max drain current. Ideal for switching applications, it features separate elements with built-in diode in a small outline package, suitable for surface mount technology.

Median Price

$0.252

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 167 parts In-Stock

1+ parts

$0.460

100+ parts

$0.200

1k+ parts

$0.110

10k+ parts

$0.056

167

$0.460

$0.200

$0.110

$0.056

Verical

USA . 160,000 parts In-Stock

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-

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$0.043

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-

$0.043

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NAC Semi

USA . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 6,779 parts In-Stock

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6,779

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 84,722 parts In-Stock

1+ parts

$0.037

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84,722

$0.037

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Corohmni

South Africa . 142 parts In-Stock

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$0.928

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142

$0.928

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Aztec Data Supply Inc.

USA . 439 parts In-Stock

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$1.310

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439

$1.310

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AZTECH Wire

Italy . 282 parts In-Stock

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$17.530

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282

$17.530

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Eastek

USA . 10,000 parts In-Stock

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10,000

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Argo Parts USA

USA . 4,249 parts In-Stock

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4,249

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Continental Prestige Electronics

USA . 3,273 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Enhance your electronic devices with the DMN33D8LDW-13 by Diodes Incorporated, a cutting-edge N-CHANNEL Small Signal FET perfect for switching applications. With a focus on quality and innovation, Diodes Incorporated delivers a product that exceeds expectations in performance and reliability. Ideal for a wide range of industries, this FET offers superior efficiency and precision. Elevate your projects today with the unmatched value and benefits of the DMN33D8LDW-13.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type:

N-CHANNEL - N-channel FETs generally have better conductivity and higher mobility, making them suitable for high-performance applications.

Configuration:

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE - This configuration allows for versatile circuit design options and the built-in diode provides protection against reverse polarity.

Transistor Application:

SWITCHING - Ideal for applications requiring fast switching speeds and high efficiency.

Surface Mount:

YES - Allows for easy and space-efficient PCB assembly.

Minimum DS Breakdown Voltage:

30 V - Provides a good margin of safety for voltage spikes or transient events.

Package Shape:

RECTANGULAR - Helps optimize space utilization on the PCB.

Terminal Form:

GULL WING - Facilitates easy soldering and reliable connections.

Operating Mode:

ENHANCEMENT MODE - Offers precise control over the transistor's conduction, enabling efficient power management.

No. of Elements:

2 - Provides additional flexibility in circuit design.

No. of Terminals:

6 - Allows for multiple connection options.

Package Style (Meter):

SMALL OUTLINE - Compact form factor suitable for space-constrained applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Ensures high performance and reliability.

Transistor Element Material:

SILICON - Silicon is the most widely used semiconductor material due to its excellent electrical properties.

Terminal Finish:

MATTE TIN - Ensures good solderability and corrosion resistance.

Maximum Drain Current (ID):

0.25 A - Suitable for low to medium power applications.

Maximum Drain-Source On Resistance:

3 ohm - Low on-resistance ensures minimal power loss.

Terminal Position:

DUAL - Provides flexibility in PCB layout design.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable solder joints during assembly.

Peak Reflow Temperature °C:

260 - Compatible with standard surface mount assembly processes.

Reference Standard:

AEC-Q101 - Complies with automotive industry quality standards.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN33D8LDW-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN33D8LDW-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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