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DMN30H4D0L-7

Diodes Incorporated

DMN30H4D0L-7 by Diodes Incorporated

DMN30H4D0L-7 by Diodes Inc. is a N-channel FET with 300V DS breakdown voltage, 0.47W power dissipation, and 4ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max temp of 150°C. This small outline transistor has a peak reflow temp of 260°C and matte tin terminal finish.

Median Price

$0.224

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 141,000 parts In-Stock

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$0.154

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$0.154

Farnell

UK . 1,745 parts In-Stock

1+ parts

-

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$0.295

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$0.180

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$0.176

1,745

-

$0.295

$0.180

$0.176

Element14

Singapore . 1,745 parts In-Stock

1+ parts

-

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$0.306

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$0.187

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$0.184

1,745

-

$0.306

$0.187

$0.184

Arrow

USA . 806 parts In-Stock

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$0.137

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806

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$0.137

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.230

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100

$0.230

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Vyrian

USA . 23,674 parts In-Stock

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23,674

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Sensible Micro Corp

USA . 17,678 parts In-Stock

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17,678

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NAC Semi

USA . 6,000 parts In-Stock

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$0.140

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$0.140

Next Level Components, LLC

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 27,070 parts In-Stock

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$0.116

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27,070

$0.116

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Semicontronic

India . 26,775 parts In-Stock

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$0.116

100+ parts

$0.113

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$0.113

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26,775

$0.116

$0.113

$0.113

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Continental Prestige Electronics

USA . 4,845 parts In-Stock

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$0.221

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$0.217

4,845

$0.221

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$0.217

Argo Parts USA

USA . 4,066 parts In-Stock

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$0.221

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$0.214

4,066

$0.221

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$0.214

Aranea Global

USA . 2,000 parts In-Stock

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$0.225

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$0.216

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2,000

$0.225

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$0.216

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Corohmni

South Africa . 10 parts In-Stock

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$0.575

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10

$0.575

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.151

100+ parts

$1.047

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$0.944

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1,000

$1.151

$1.047

$0.944

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Aztec Data Supply Inc.

USA . 3,832 parts In-Stock

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$1.610

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3,832

$1.610

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Robosynatics

Brazil . 20,653 parts In-Stock

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Lucentia Tech

USA . 20,653 parts In-Stock

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$0.804

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$0.787

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$0.787

20,653

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$0.804

$0.787

$0.787

Lixinc

USA . 15,793 parts In-Stock

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15,793

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Overview

Unlock the power of technology with the DMN30H4D0L-7 from Diodes Incorporated. This small signal field effect transistor is a game-changer in switching applications, offering reliability and efficiency like no other. With a maximum DS breakdown voltage of 300V and a maximum drain-source on resistance of 4 ohm, this N-channel transistor is designed to meet your needs with precision. Say goodbye to compromises and hello to high-performance with the DMN30H4D0L-7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Suitable for applications where N-channel transistors are required.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode for reverse voltage protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance.

Surface Mount: YES

Enables easy and secure mounting on a circuit board.

Minimum DS Breakdown Voltage: 300 V

High breakdown voltage for reliable operation in various power circuits.

Package Shape: RECTANGULAR

Compact rectangular shape for space-saving installation.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and easy soldering.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor.

No. of Terminals: 3

Simple 3-terminal design for straightforward circuit integration.

Maximum Power Dissipation (Abs.): 0.47 W

Efficient power dissipation capability for reliability under load.

Package Style (Meter): SMALL OUTLINE

Small outline package for compact and space-efficient circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology for improved performance and reliability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature for versatile use in different environments.

Transistor Element Material: SILICON

Silicon material for reliable and consistent transistor performance.

Minimum Operating Temperature: -55 °C

Wide temperature range for operation in various climates and conditions.

Terminal Finish: MATTE TIN

Matte tin finish for corrosion resistance and reliable electrical connections.

Maximum Drain Current (ID): 0.25 A

High maximum drain current for robust performance in power circuits.

Maximum Drain-Source On Resistance: 4 ohm

Low drain-source on resistance for efficient power flow.

Terminal Position: DUAL

Dual terminal position for flexibility in circuit design and integration.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for secure and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for efficient soldering and durable connections.

Maximum Feedback Capacitance (Crss): 8.7 pF

Low feedback capacitance for improved signal integrity and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN30H4D0L-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8.7 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN30H4D0L-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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