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ACPM-7353-TR1G

Broadcom

ACPM-7353-TR1G by Broadcom

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Terminal Pitch: .73 mm;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 423,703 parts In-Stock

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Bristol Electronics

USA . 4,460 parts In-Stock

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Vyrian

USA . 485 parts In-Stock

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Digiode

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423

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Distributors (Availability)

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Decca Corp

Germany . 1,638 parts In-Stock

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$16.000

100+ parts

$15.680

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$15.523

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1,638

$16.000

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$15.523

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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GreenTree Electronics

Israel . 2,901 parts In-Stock

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Supply Digital

USA . 2,442 parts In-Stock

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Northwest PG Solutions

USA . 2,176 parts In-Stock

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$3.445

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Kepictronics

USA . 1,819 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,766 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,177 parts In-Stock

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Authorized Procurement Solutions

USA . 499 parts In-Stock

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499

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Native Components

USA . 255 parts In-Stock

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$3.410

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Corphita

USA . 158 parts In-Stock

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Technical Specifications

Cellphone ICs ACPM-7353-TR1G attributes and parameters. Explore more Cellphone ICs devices from Broadcom

Specs

JESD-30 Code:

R-XDMA-N14

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.4 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.73 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

ACPM-7353-TR1G Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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