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ACPM-7831-TR1

Broadcom

ACPM-7831-TR1 by Broadcom

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 402 parts In-Stock

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402

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Vyrian

USA . 249 parts In-Stock

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249

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Distributors (Availability)

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Native Components

USA . 225 parts In-Stock

1+ parts

$0.464

100+ parts

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$0.445

225

$0.464

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$0.445

Northwest PG Solutions

USA . 1,811 parts In-Stock

1+ parts

$0.510

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$0.450

1,811

$0.510

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$0.450

Decca Corp

Germany . 402 parts In-Stock

1+ parts

$25.000

100+ parts

$24.500

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$24.255

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402

$25.000

$24.500

$24.255

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Corphita

USA . 414 parts In-Stock

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414

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Supply Digital

USA . 281 parts In-Stock

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281

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Technical Specifications

Cellphone ICs ACPM-7831-TR1 attributes and parameters. Explore more Cellphone ICs devices from Broadcom

Specs

JESD-30 Code:

R-XDMA-N6

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Nominal Supply Voltage:

3.4 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

ACPM-7831-TR1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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