Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
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Cellphone ICs ACPM-7831-TR1 attributes and parameters. Explore more Cellphone ICs devices from Broadcom
JESD-30 Code:
JESD-609 Code:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Qualification:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Position:
ACPM-7831-TR1 Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8541.29.00.75
Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
LM317D2TG
Onsemi
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
BAV99
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
Philips Components
Vishay Telefunken
TOBY-L210-03S
U-blox Ag
TOBY-L210-03S by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits at 3.8V supply voltage. Ideal for compact mobile devices due to its small dimensions of 24.8mm width and 35.6mm length.
MAX2690
Analog Devices
RF AND BASEBAND CIRCUIT; JESD-609 Code: e0; Terminal Finish: TIN LEAD; Qualification: Not Qualified;
LMV227SD
Texas Instruments
LMV227SD by Texas Instruments is a cellphone IC with 6 terminals in a small outline, very thin profile package. It operates b/w -40 to 85°C and has a nominal voltage of 2.7V, making it suitable for RF and baseband circuits in industrial telecom applications.
LMV226TLX/NOPB
LMV226TLX/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C, industrial temperature grade, and low supply current of 8mA. Ideal for telecom applications requiring RF and baseband circuit integration in a compact grid array package.
HMC497LP4
HMC497LP4 by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The package is square-shaped, made of plastic/epoxy, with a very thin profile suitable for surface mount assembly.
ADF7020-11BCPZ-RL
Analog Devices' ADF7020-11BCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
TCM8002IFR
Texas Instruments TCM8002IFR is a cellphone IC with 44 terminals in a square flatpack package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include CMOS technology, 3.3V supply voltage, and baseband circuit for telecom applications.
ADF7901BRUZ-RL
Analog Devices' ADF7901BRUZ-RL is a cellphone IC with 24 terminals, operating at 0-50 °C. It features a 3V supply voltage, RF and baseband circuitry for telecom applications. The small outline package has a thin profile, matte tin finish, and dual terminal position.
RFFM6903TR13
Rf Micro Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HLGA; Package Shape: SQUARE;
ADF7901BRUZ
Analog Devices' ADF7901BRUZ is a cellphone IC with 24 terminals in a small outline package. It operates at 3V, suitable for RF and baseband circuits, with a temperature range of 0-50 °C. The device has a matte tin finish, gull wing terminal form, and shrink pitch package style.
HMC686LP4
Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.
LMH2120UM
LMH2120UM by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The package body material is plastic/epoxy with 6 terminals on the bottom side.
LMH2121TME/NOPB
LMH2121TME/NOPB by Texas Instruments is a cellphone IC with 4 terminals in a rectangular package. It operates b/w -40 to 85°C, with a supply voltage of 2.7V and max current of 4.7mA. This RF and baseband circuit has a very thin profile, fine pitch grid array style suitable for industrial telecom applications.
J-N3-B3E6-LR
Telit Communications Plc
Telit Communications Plc's J-N3-B3E6-LR is a cellphone IC with 24 terminals, operating temp. range of -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The small outline package measures 12.2mm x 16mm with a seated height of 2.4mm, making it ideal for compact devices.
CC1050-RTB1
CC1050-RTB1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
ADF4360-7BCPZRL
Analog Devices' ADF4360-7BCPZRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
HMC832LP6GETR
Analog Devices' HMC832LP6GETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
AD6654CBC
AD6654CBC by Analog Devices is a CELLPHONE IC with 256 terminals in a GRID ARRAY package. Operating temperature ranges from -25 to 85 °C, suitable for BASEBAND CIRCUIT applications. Features include TIN LEAD SILVER finish, 1.8V supply voltage, and compact 17x17mm size.
TLV321AC36CPT
TLV321AC36CPT by Texas Instruments is a 48-terminal cellphone IC with CMOS technology. It operates b/w 0-70°C, suitable for baseband circuits. The flatpack package has low profile and fine pitch, making it ideal for compact mobile devices.
ADF4360-2BCPZRL
Analog Devices' ADF4360-2BCPZRL is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and matte tin finish. This square chip carrier is ideal for baseband circuits in industrial telecom applications due to its compact size and low profile design.
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ACPM-9001-BLK
Broadcom
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: DMA; Package Shape: RECTANGULAR; Terminal Position: DUAL;
ACPM-7353-BLK
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Width: 4 mm;
ACPM-7051-BLK
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Terminal Position: QUAD;
ACPM-7831-BLK
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Shape: RECTANGULAR; Qualification: Not Qualified;
ACPM-7355-BLK
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
ACPM-7251-BLK
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Surface Mount: YES;
ACPM-9005-BLK
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: DMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
ACPM-5252-TR1
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Code: BCC; Package Shape: RECTANGULAR;
ACPM-7353-TR1G
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Terminal Pitch: .73 mm;
ACPM-7051-TR1
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; No. of Functions: 1; JESD-30 Code: R-XQMA-N24;
ACPM-7800-TR1
RF AND BASEBAND CIRCUIT; Terminal Form: BUTT; No. of Terminals: 42; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; JESD-30 Code: R-XQMA-B42;
ACPM-7355-TR1
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel;
ACPM-7081-TR1
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; JESD-30 Code: R-XQMA-N24;
ACPM-5281-TR1
ACPM-7251-TR1
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Terminal Position: QUAD; Maximum Seated Height: 1 mm;
ACPM-5252-BLK
ACPM-5281-BLK
ACPM-7081-BLK
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; No. of Functions: 1; Length: 7.5 mm;
ACPM-7788-TR1
RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 42; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-XQCC-N42;
ACPM-7831-TR1
Agilent Technologies
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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